Principal R&D Thermal Product Development Engineer
About The Position
Job Overview: TE Connectivity's R&D/Product Development Engineering Teams are responsible for driving new products from concept to high-volume manufacturing. From market definition through production and release, the team conduct feasibility studies perform/direct/support detailed design, prototyping, testing, and manufacturing ramp of new and modified designs define material requirements and new or improved manufacturing processes assist in the qualification of suppliers for new product The Thermal Development Group within the Advanced Development Team has responsibility for finding innovative solutions to thermal challenges in the high-speed interconnect industry, including thermal design and evaluation of associated products. Through modeling and physical validation, those solutions are enabled by the larger TE manufacturing base to be brought to the global market.
Requirements
- Bachelor's Degree in related field required; Masters or PhD preferred.
- 10+ years of engineering experience, including 6+ years in the electronics cooling industry.
- 10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool.
- 3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaim
- Experience with and knowledge of liquid and/or immersion cooling.
- Self-motivated, efficient, able to work with little or no supervision, and committed to a team approach.
- Strong interpersonal, organization, and project management skills.
- Ability to prioritize responsibilities in a fast-paced work environment.
- Ability to understand and discuss technical engineering issues.
- Ability to read and understand engineering drawings and specifications.
- Comfortable interfacing with and presenting to various disciplines.
- Attention to detail and accuracy.
- Ability to work on multiple concurrent projects.
Nice To Haves
- Experience with mechanical structural analysis is a plus.
- Experience in and knowledge of the high-speed digital industry is a plus.
- Experience in core processes such as stamping, molding, plating, and assembly preferred.
- Familiarity with standards related to data center cooling (e.g, ASHRAE)
- Track record of innovation (patents, publications, etc.)
Responsibilities
- Develop innovative cooling solutions for the high-speed digital interconnect industry.
- Research and apply emerging technologies to new product development.
- Analyze electronics cooling problems through robust modeling methods.
- Address near-adjacent technical challenges such as: Manufacturability Tolerancing Structural Integrity Life Cycle Cost & Market Acceptance
- Help expand global Best Known Methods related to simulation.
- Present data and ideas in a clear and impactful manner.
- Interface with engineering teams of various disciplines, including external customers.
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Number of Employees
5,001-10,000 employees
