Principal Process Engineer, APTD Bonding

Micron Technology • Boise, ID

72d

About The Position

As a Principal Process Engineer in Advanced Packaging, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology.

Requirements

• Bachelor's or Master's degree in Electrical, Mechanical, Computer Engineering, Chemistry, Physics, Materials, or related field or equivalent experience
• 8 years of validated experience in Process Integration/Development or Package Integration within the semiconductor industry
• Strong architectural sense to translate process/design into technical requirements and specifications
• 10 years expertise in data extraction, analysis, and reporting tools such as JMP, Python, R
• In-depth understanding of process flows, interactions, and their effects on yield, performance, and reliability
• Technical knowledge and hands-on experience in die-to-wafer and wafer-to-wafer bonding processes and equipment is a must.
• Experience in various assembly processes like Dicing, Thinning, Molding with expertise in Package Characterization and Process Metrology Memory Technology Integration of NAND and or DRAM including 3D Architectures

Nice To Haves

• Master's or PhD in Materials Science, Chemistry, Physics, Mechanical or Metallurgical Engineering

Responsibilities

• Identify, diagnose and resolve assembly process related problems
• Coordinate and complete process, equipment, and material evaluation / optimization initiatives and make changes at process step
• Lead / participate in continuous yield improvement and cost reduction activities
• Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction
• Support SPC/FDC/RMS/APC
• Support site to site portability
• Lead audit material suppliers to achieve quality, cost and risk management objectives
• Support internal and external audits

Benefits

• Choice of medical, dental and vision plans
• Benefit programs that help protect your income if you are unable to work due to illness or injury
• Paid family leave
• Robust paid time-off program
• Paid holidays

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Master's degree
• Number of Employees: 5,001-10,000 employees