Principal Packaging Engineer

Skyworks • Nashua, NH

297d • $126,500 - $241,700

About The Position

Skyworks is seeking a Principal Packaging Engineer in the Skyworks Austin, Texas location to support the Mixed Signal Solutions Business Unit (MSSBU). The primary responsibility would be to support design with NPI packaging. You will be involved in the diverse areas of SOIC, Lead Frame, QFN, LGA, BGA and WLCSP package engineering assembly. As a highly skilled semiconductor Packaging Engineer, you will be a key player working with teams like R D Engineers, Device, Process experts, Module Design Team, Program Management and Operations.

Requirements

• Mechanical Engineering degree required - B.S. with 10+ years experience.
• Strong Experience in New Product Introduction / Package Engineering / Design in the areas of SOIC, QFN, Lead Frame, LGA, BGA and WLCSP Semiconductor package assembly.
• Experience in semiconductor packaging assembly processes such as solder attach, die attach, wire-bonding, over-molding, materials curing, BGA, etc.
• Experience in IC packaging as defined in JEDEC, IATF and AEC standards.
• Strong experience of various electronic packaging technologies (SiP, MCM, WLCSP, Dual-sided packages etc.), structures, materials, and processes.
• Experience with IC packaging modeling & simulation and packaging failure analysis.
• Strong understanding of Product Development, manufacturing processes and supply chain management.
• Excellent leadership, communication with interpersonal skills and used to work in a multi-cultural environment.
• Strong analytical and problem-solving skills, both technical and interpersonal.
• Must have excellent verbal and written communication skills and presentation skills.
• Works autonomously, well-organized, with a good attention to detail, while setting high standards in all aspects of the work.

Responsibilities

• Provide design support and material selection to assure high yielding, high reliability and low-cost products.
• Provide new packaging technologies as well as support to existing legacy products.
• Collaborate with cross-functional teams to ensure adherence to all design and technology rules, define technology choice, timelines, milestones and deliverables for new product launch.
• Lead end-to-end readiness ensuring a smooth transition from product development to production release, coordinating activities across Design, Process, Test, Operations and Module team to meet Quality, Performance and Schedule.
• Work with Skyworks' Internal Assembly House in Mexicali and various OSATs across Asia for assembly location selection and subsequent assembly.
• Lead and coordinate the Product Readiness for each product release in the areas of Technology, Capability, Capacity and Cost.
• Identify potential risks and challenges in the NPI process and develop mitigation plans.
• Collaborate and openly debate with team to manage projects, solve problems, discuss challenging issues, and learn more about critical issues as a group.
• Report and maintain knowledge on product status to executive leadership by preparing appropriate reports.

Benefits

• Access to healthcare benefits (including a premium-free medical plan option)
• 401(k) plan and company match
• Employee stock purchase plan
• Paid time off (including vacation, sick/wellness, parental leave)
• Eligibility to participate in an incentive plan
• Additional awards, including recognition and stock based on individual and/or company performance

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Bachelor's degree