Principal Package Design Engineer

Marvell Technology • Austin, TX

294d • $148,500 - $219,780

About The Position

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. The Marvell Advanced Packaging R&D team is responsible for package design and technology development to meet the electrical, mechanical, thermal and system requirements for the next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions. The group focuses on signal integrity, power integrity, thermal integrity, mechanical integrity, processability, manufacturability, and reliability, involving high speed signaling and complex power delivery networks (PDNs) requiring innovative and custom solutions to meet constantly evolving customer needs. Many of the new designs require multi-chip, multiple component configurations involving, but not limited to, 2.5D and 3D packages, Co-packaged copper or optics and advanced substrates. Marvell has partnered with the world's leading manufacturers to solve our customer's most challenging designs and integrations with industry-leading packaging technologies.

Requirements

• Extensive experience in PCB substrates and board design for advanced package technologies with deep understanding of design for manufacturing and reliability.
• Bachelor's degree in electrical engineering, mechanical engineering or related fields and 15+ years of related professional experience or master's degree and 12+ years of related professional experience or PhD degree with 8+ years of experience.
• Deep and innovative thinking, fundamental understanding of design rules, breakout, place and route, signal shielding, reference plane, power distribution, pinout considering overall package and system requirements.
• Mastery in tools and workflows: APD and SiP, AutoCAD, SolidWorks, Virtuoso.
• Mastery in design layout for DDR, SerDes, D2D, D2H, ADC, DAC, PCIE, Ethernet, etc.
• Good understanding of signal and power integrity at substrates, board, package, and system level.
• Understanding of advanced 2.5D/3D package technology including (a) CoWoS-S/R/L, (b) EMIB, (c) CPO, (d) CPC.
• Understanding of chip-package interaction and failure mechanism at component and board level, thermal interface materials and thermal solutions.
• Ability to manage programs involving cross-functional teams.
• Strong interpersonal skills and willingness to learn new things are necessary along with the ability to work with stakeholders in multiple time zones across the globe.
• Ability to influence suppliers to align their roadmap with company goals.
• Strong communication, presentation and documentation skills.

Nice To Haves

• Understanding of substrate and Board manufacturing process and reliability.
• Understanding of optical routing on substrates.
• Scripting skills in Python.
• Fundamental understanding of material properties, package fail mechanism.

Responsibilities

• Perform design feasibility studies for new PCB substrates and board technologies to enhance performance while meeting manufacturing and reliability requirements.
• Optimize for power, performance, area, thermal and mechanical.
• Develop symbols and libraries, improve workflows and methodology; automate design and design verification.
• Collaborate with IP, Si design, SI/PI, thermal/mechanical, production and test teams to cover all bases.
• Work with stakeholders to define and validate advanced design rule roadmap for interposer, substrates and packages.
• Work with vendors on substrates and board manufacturing.
• Create proof-of-concept samples.
• Create package solutions for datacenter silicon package, innovate routing and layout, drive material and process advancements, and validate solutions at component and system levels.
• Create package outline drawings, bonding diagrams, 3D rendering of package drawing.

Benefits

• Flexible time off
• 401k
• Year-end shutdown
• Floating holidays
• Paid time off to volunteer

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Master's degree