Principal Optical Reliability Engineer

Astera LabsSan Jose, CA
$185,000 - $230,000

About The Position

Astera Labs (NASDAQ: ALAB) provides rack-scale AI infrastructure through purpose-built connectivity solutions. By collaborating with hyperscalers and ecosystem partners, Astera Labs enables organizations to unlock the full potential of modern AI. Astera Labs’ Intelligent Connectivity Platform integrates CXL®, Ethernet, NVLink, PCIe®, and UALink™ semiconductor-based technologies with the company’s COSMOS software suite to unify diverse components into cohesive, flexible systems that deliver end-to-end scale-up, and scale-out connectivity. The company’s custom connectivity solutions business complements its standards-based portfolio, enabling customers to deploy tailored architectures to meet their unique infrastructure requirements. Discover more at www.asteralabs.com . Role Overview Astera Labs is seeking an experienced and hands-on Principal Optical Reliability Engineer to drive reliability strategy across our cutting-edge portfolio of connectivity products, with a focus on silicon photonics and optical components. As AI infrastructure demands unprecedented bandwidth and performance, this role is critical to ensuring our products deliver exceptional reliability through end-of-life. You will lead reliability initiatives and serve as an internal consultant, defining and implementing methodologies across component, chiplet, photonic, and board-level products. This is a high-impact position where you'll partner closely with design, product/test engineering, quality, and manufacturing teams to embed reliability-aware principles.

Requirements

  • Master's degree in Electrical Engineering, Applied Physics, Photonics, or a related field
  • 8+ years of experience in semiconductor reliability, with direct experience in silicon photonics, optical components, or optoelectronic device reliability
  • Strong background in semiconductor physics, device modeling, and reliability verification techniques including statistical and probability techniques
  • Deep knowledge of advanced packaging technologies, including 2.5D, 3D, and chiplet architectures, as well as module and system board reliability
  • Working knowledge of electronic components/devices and their failure modes and mechanisms
  • Proven leadership in driving complex technical issues to closure across global, cross-functional teams

Nice To Haves

  • PhD in Electrical Engineering, Applied Physics, or Photonics
  • Experience with silicon photonics reliability, including laser aging, photodetector degradation, and fiber coupling reliability
  • Knowledge of high-performance compute and AI cloud infrastructure, as well as switch/network interfaces
  • Experience with PCBA (printed circuit board assembly) design, fabrication, and validation testing
  • Strong experience in product reliability in the context of mechanical, thermal, and electrical stresses for modules and board assemblies
  • Excellent communication skills with the ability to articulate technical concepts clearly across all levels of the organization

Responsibilities

  • Reliability Strategy & Methodology Develop and implement comprehensive design reliability methodologies for semiconductor circuits and optical systems, including pre-qualification, production release, ongoing reliability monitoring (ORM), and soft error evaluation Lead the application of advanced reliability modeling techniques to analyze trade-offs between performance and long-term product reliability Establish and refine usage models to guide design-phase reliability assessments and integrate learning from manufacturing and field return data in post-silicon validation
  • Failure Analysis & Root Cause Apply expert knowledge of semiconductor and optical reliability failure mechanisms, including Electrostatic Discharge (ESD), Latch-Up (LU), Soft Errors, Gate Oxide Time-Dependent Dielectric Breakdown (GOX TDDB), Electromigration, Device Aging, laser degradation, and photodetector wear-out Utilize a hands-on approach to comprehend silicon, photonic, and package-level failure mechanisms, collaborating seamlessly with internal and external teams to drive root cause analysis and resolution Evaluate qualification results for new product introductions and drive continuous improvement in design-for-reliability tools, processes, and organizational knowledge
  • Cross-Functional Collaboration & Vendor Management Collaborate across design, product engineering, manufacturing, and reliability teams to capture and institutionalize best practices that improve product robustness and reduce DPPM Serve as a subject matter expert helping design engineers incorporate reliability-aware design principles early in development Work closely with vendors to review and interpret component specifications, reliability data, and qualification reports, including Mean Time Between Failures (MTBF), failure-rate predictions, derating analysis, and stress test results
© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service