Principal Memory Sustaining Physical Design Engineer, HBM

Micron Technology • Richardson, TX

69d

About The Position

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing advanced memory solutions. The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability. As a HBM Memory Physical Design Engineer in a sustaining role, you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration (PI), Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will be responsible for supporting design and development of critical analog, mixed-signal, digital block and full chip level integration from physical design and layout design perspective! This includes creating floorplans that optimize circuit placement, signal routing, and power delivery, as well as deliver block-level layouts using advanced foundry process node.

Requirements

• Bachelor or Masters degree in Electrical Engineering or related field.
• Proven significant experience of 8+ year with BS or 6+ year with MS.
• Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS.
• Good understanding of Analog Layout fundamentals (e.g., Matching, Electro-migration, Latch-up, coupling, crosstalk, IR-drop, active and passive static device parasitic etc.).
• Have a good understanding of timing/area/power/complexity trade-offs in DRAM or mixed-signal design.
• Firsthand experience of crafting layout of analog and mixed signals such as sense amplifier, LDO, PLL etc.

Nice To Haves

• Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other team members and leadership.
• A self-motivated, hard-working team player who enjoys working with diverse abilities and backgrounds.
• Excellent problem-solving and analytical skills.
• Proven track record of innovation and problem-solving in high-performance memory development.
• Prior experience with DRAM product bring-up and debug.
• Prior experience with package technologies (TSV, hybrid bonding, interposers, etc).

Responsibilities

• Implement layout changes to resolve issues identified on current HBM designs on silicon and drive towards a timely and efficient tapeout.
• Interact with teams like DE, PE, PI and TD to understand the challenges due to process limitations and propose layout solutions to alleviate the issues.
• Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption.
• Responsible for floor plans that optimize circuit placement, signal routing, and power delivery.
• Deliver block-level (analog or mixed signal) layouts using advanced foundry process node if needed.
• Contribute to the development of new HBM product opportunities by assisting with the overall planning and optimization of Memory, Logic, and Analog circuits layout.
• Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products.
• Mentor new hires as needed.

Benefits

• Choice of medical, dental and vision plans.
• Benefit programs that help protect your income if you are unable to work due to illness or injury.
• Paid family leave.
• Robust paid time-off program.
• Paid holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Master's degree
• Number of Employees: 5,001-10,000 employees