Principal Mechanical Engineer

RTX•Goleta, CA

1d•Onsite

About The Position

As a Principal Mechanical Engineer within the Electronic Warfare Mechanical Design Hardware Department, you will serve as the mechanical technical authority for airborne RF and digital processor subsystems, leading hardware development from early concept through production deployment. This is an onsite position in Goleta, CA.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience or an advanced degree in a related field and minimum 5 years’ experience.
Experience designing and developing electronics packaging solutions for high-reliability systems.
Experience applying Geometric Dimension Tolerance (GD&T) and American Society of Mechanical Engineers (ASME) drawing standards to production hardware.
Experience with 3D solid modeling tools (Creo/Pro/Engineer or similar) for mechanical design and documentation.
Experience supporting hardware through environmental qualifications (e.g., vibration, shock, thermal).
The ability to obtain and maintain a U.S. government issued security clearance is required.
U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
Active and existing security clearance required after day 1

Nice To Haves

Experience with Electronic Warfare (EW), radar, RF subsystems, or airborne electronics.
Experience serving as a subsystem lead, REA, IPTL, or similar technical authority role.
Experience with thermal and structural analysis methods for electronics hardware.
Experience with CCA/PCB integration, cabling and harness design, or RF isolation features.
Experience managing cost and schedule elements of engineering scope (e.g., EVM exposure).
Experience supporting design reviews (PDR, CDR, TRR) and presenting technical data to customers.
Experience developing proposals, including Basis of Estimates (BOEs) or technical volume contributions.
Experience performing root cause investigations and implementing corrective actions in production environments.

Responsibilities

Lead the mechanical development of airborne RF and digital electronics subsystems from concept through production.
Serve as the mechanical technical authority (REA/IPTL) on assigned programs, ensuring alignment to technical, cost, and schedule objectives.
Own subsystem-level mechanical solutions, ensuring performance in demanding thermal and high-vibration environments.
Collaborate cross-functionally with Electrical, Systems, Manufacturing, and Supply Chain teams to deliver integrated hardware solutions.
Represent the mechanical discipline in internal and external design reviews and customer engagements.
Mentor and provide technical guidance to junior engineers across the matrixed team.
Support hardware integration, verification, and production readiness activities within secure program environments.