Principal Mechanical Design Engineer

Qorvo • Richardson, TX

1d

About The Position

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

Qorvo is seeking an experienced Mechanical Design Engineer to join the Defense & Aerospace SSPA product development team.
This is a leadership role within the D&A SSPA product development team.  You will apply your extensive mechanical experience of RF/electronics circuits, modules and chassis/LRUs design to derive innovative, cutting-edge solid-state RF power amplifier solutions for defense communications, radar and electronic warfare (EW) applications.  

You will be assigned goals and allocated technical, program, schedule, and cost requirements at a high level.  You will derive and implement plans to ensure those goals are met and produce hardware designs in compliance with requirements.

As part of the application and interview process, you will describe how your career experience aligns with the responsibilities of this position.

Requirements

• BS/MS in Mechanical Engineering.
• 12+ years’ experience developing RF hardware and electronics enclosures for defense, aerospace, radar, or similar applications.
• Proficiency with CAD tools (SolidWorks preferred), FEA stress and thermal simulations (Ansys preferred) and computational fluid dynamics (CFD) tools (Ansys and/or Flotherm preferred).
• Experience designing and implementing forced-air convection cooling and liquid cooling of high-powered electronics.
• Strong background in structural, thermal, and vibration FEA analysis of RF and electronics.
• Practical experience translating MIL-STD-461, MIL-STD-810 and DO-160 requirements into compliant electronics enclosures designs.
• This position is not eligible for visa sponsorship by the Company.
• This position requires a Security Clearance. Applicant must be a US Citizen and have the ability to obtain and maintain a US Government security clearance.

Responsibilities

• Design high-power electronics/RF modules, enclosures and LRUs to withstand exposure to shock, vibration, humidity, salt fog, temperature and altitude extremes, and be compliant with EMI/EMC requirements.
• Detailed design of power and signal distribution (wire harness/cables, coax cables, waveguides).
• Conduct FEA simulations of PCBAs to predict PCBA and electrical component junction/channel temperatures and derive/implement thermal control schemes (forced air and liquid cooling).
• Collaborate with RF, Electrical, Test and Manufacturing Engineers, and Program Management.
• Conduct and lead peer and program design reviews.
• Compose and maintain bills of materials (BOM) and be responsible for revision/version control of the same.
• Compose design verification test plans (DVT) and qualification test plans.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level