As a senior member of Intel's Thermal Mechanical Engineering team, you will lead the development of advanced thermal and mechanical solutions for Data Center CPUs—spanning silicon, system, and datacenter levels. This role requires deep technical expertise, strong collaboration skills, and the ability to thrive in a fast-paced environment. Key Responsibilities: Define product power and temperature limits based on system cooling capabilities. Provide thermal parameters for manufacturing teams. Conduct thermal analysis, design, prototyping, and testing of air and liquid cooling solutions. Apply expertise in conduction, convection, radiation, heat sinks, heat pipes, and vapor chambers. Perform thermal and pressure drop characterization and validate models. Optimize thermal management systems, including materials, contact pressure, and firmware policies. Simulate thermal behavior from silicon to PCB, considering materials, layout, and transient effects. Lead thermal design reviews and resolve technical issues. Collaborate cross-functionally with design, power, reliability, electrical, and mechanical teams. Drive technical readiness through research, experiments, and prototyping. Additional Responsibilities: Serve as a domain expert influencing technical direction across Intel and the industry. Mentor technical leaders and promote Intel values. Formulate technical strategy aligned with organizational goals and deliver leadership solutions. Drive innovation in modeling, simulation, and automation to accelerate design cycles. Analyze performance, power, and thermal characteristics to guide design trade-offs. Lead teams in detailed design, testing, and prototype fabrication.
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Job Type
Full-time
Career Level
Senior
Number of Employees
5,001-10,000 employees