Principal Engineer, Packaging Engineering

Sandisk • Milpitas, CA

2d

About The Position

Sandisk understands how people and businesses consume data and we relentlessly innovate to deliver solutions that enable today’s needs and tomorrow’s next big ideas. With a rich history of groundbreaking innovations in Flash and advanced memory technologies, our solutions have become the beating heart of the digital world we’re living in and that we have the power to shape. Sandisk meets people and businesses at the intersection of their aspirations and the moment, enabling them to keep moving and pushing possibility forward. We do this through the balance of our powerhouse manufacturing capabilities and our industry-leading portfolio of products that are recognized globally for innovation, performance and quality. Sandisk has two facilities recognized by the World Economic Forum as part of the Global Lighthouse Network for advanced 4IR innovations. These facilities were also recognized as Sustainability Lighthouses for breakthroughs in efficient operations. With our global reach, we ensure the global supply chain has access to the Flash memory it needs to keep our world moving forward. ESSENTIAL DUTIES AND RESPONSIBILITIES: As a Packaging Engineer, you will work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level. The ideal candidate will be responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques. The focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments.

Requirements

• Ph.D. in Mechanical Engineering plus >3 years, or M.S. in Mechanical Engineering plus >5 years of relevant industrial experience.
• Solid knowledge through academic coursework or experience required in thermal modeling and measurements of IC packaging and related areas.
• A strong background in thermal sciences with emphasis on both analytical and measurement methods.
• Thorough knowledge of material thermal properties and test methods.
• Working knowledge in applying Computational Fluid Dynamics (CFD) in related areas; and familiarity with software tools such as FloTHERM and ANSYS Icepak.
• Working knowledge in scientific programming
• Demonstrated strong work ethic.
• Ability to work in a team environment and interact with other engineers to define and implement numerical and lab experiments for feasibility and validation of concepts and solutions to support new package technology development.
• Strong oral and written communication skills.
• Demonstrated strong work ethic.
• Ability to work in a global team environment and interact with other engineers to define and implement experiments and conduct relevant simulation for feasibility and validation of concepts and provide design solutions to support new package technology development.

Responsibilities

• work in the Packaging R&D group on thermal designs across semiconductor packaging level, flash product printed circuited board assembly (PCBA) level, and host level
• responsible for thermal modeling (CFD) and validation of flash products PCBA using analytical/numerical analysis and measurement techniques
• focus will be on solutions to meet increased demands for small form factor packages with constrained physical and thermal environments

Benefits

• You will be eligible to participate in Sandisk's Short-Term Incentive (STI) Plan, which provides incentive awards based on Company and individual performance.
• Depending on your role and your performance, you may be eligible to participate in our annual Long-Term Incentive (LTI) program, which consists of restricted stock units (RSUs) or cash equivalents, pursuant to the terms of the LTI plan.
• Please note that not all roles are eligible to participate in the LTI program, and not all roles are eligible for equity under the LTI plan.
• RSU awards are also available to eligible new hires, subject to Sandisk's Standard Terms and Conditions for Restricted Stock Unit Awards.
• We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program, employee stock purchase plan, and the Sandisk's Savings 401(k) Plan.

What This Job Offers

• Job Type: Full-time
• Career Level: Principal
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees