GlobalFoundries-posted 3 months ago
$132,704 - $145,800/Yr
5,001-10,000 employees

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. The role is responsible for ownership of semiconductor devices as a foundry process integration engineer, working on customer-driven new product tapeouts to ensure first-time product success and provide continuous process improvements for volume production.

  • Ownership of semiconductor devices as a foundry process integration engineer.
  • Work on customer driven new product tapeouts to ensure first-time product success.
  • Provide continuous process improvements for volume production.
  • Independent ownership of high-volume or multiple products.
  • Drive process integration related issues from identification and investigation to resolution.
  • Organize baseline yield improvements and develop overall Continuous Improvement Plans (CIPs).
  • Maintain regular external customer communication.
  • Guide and train new engineers from initial training up to product ownership and direct customer interaction.
  • Develop custom or derivative processes to meet customer needs.
  • Support new designs with module characterization and design rule development.
  • Collaborate on other projects and/or assignments as needed.
  • Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements.
  • PHD degree or foreign equivalent in Electrical Engineering, Micro and Nanoscale Systems or closely related field of study.
  • 3 years in job offered or Integration Engineering related job titles in a semiconductor development or manufacturing.
  • Experience in semiconductor manufacturing process.
  • Experience in new product tapeout handling.
  • Experience in product failure and material analysis.
  • Experience in co-working with process module, manufacturing and other relevant teams.
  • Experience in Statistical Process Control (SPC) and/or Design of Experiments (DOE).
  • Experience in process/electrical/sort yield issues investigation, resolution and improvement.
  • Experience in Lean Manufacturing principles.
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