Principal Engineer, Hardware Development Engineering
About The Position
At Western Digital, our vision is to power global innovation and push the boundaries of technology to make what you thought was once impossible, possible. At our core, Western Digital is a company of problem solvers. People achieve extraordinary things given the right technology. For decades, we’ve been doing just that—our technology helped people put a man on the moon and capture the first-ever picture of a black hole. We offer an expansive portfolio of technologies, HDDs, and platforms for business, creative professionals, and consumers alike under our Western Digital®, WD®, WD_BLACK™, and SanDisk® Professional brands. We are a key partner to some of the largest and highest-growth organizations in the world. From enabling systems to make cities safer and more connected, to powering the data centers behind many of the world’s biggest companies and hyperscale cloud providers, to meeting the massive and ever-growing data storage needs of the AI era, Western Digital is fueling a brighter, smarter future. Today’s exceptional challenges require your unique skills. Together, we can build the future of data storage.
Requirements
- 1 to 4 years of experience with PVD thin film deposition and characterization.
- MS or PhD Degree in Engineering, Physics, Materials Science or a related field.
Nice To Haves
- Hands on experience with magnetic thin film properties measurements, understanding of TMR head technology both at the full film and device level or strong statistical data analysis skills are preferred.
Responsibilities
- To sustain the magnetoresistive (TMR sensor) film deposition operation and characterize the TMR sensor film magnetic properties, such as TMR film blocking temperature, magnetic moment, pinning field and crystal structures by VSM, TEM and XRF/XRR.
- Responsible to analyze the wafer processing and probing results.
- To correlate the wafer probing results to wafer individual processing steps and materials to create action items and recommendations to resolve the production yield and quality issues.
- To perform and/or coordinate wafer level F/A activities related to TMR deposition processes, such as TEM analysis, wafer level SPC audit to identify possible root causes for all released products.
- Work with advanced reader sensor stack development group to transfer new reader sensor deposition processes into production.
Benefits
- We offer a comprehensive package of benefits including paid vacation time; paid sick leave; medical/dental/vision insurance; life, accident and disability insurance; tax-advantaged flexible spending and health savings accounts; employee assistance program; other voluntary benefit programs such as supplemental life and AD&D, legal plan, pet insurance, critical illness, accident and hospital indemnity; tuition reimbursement; transit; the Applause Program; employee stock purchase plan; and the Western Digital Savings 401(k) Plan.
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What This Job Offers
Job Type
Full-time
Career Level
Principal
Number of Employees
5,001-10,000 employees
