Principal Digital Engineer
About The Position
This is an opportunity to join Renesas Infrastructure and Mixed-Signal Division, Memory Interface Product Line. You will join the team to develop the next-generation device with an embedded processor subsystem and security function. Renesas is looking for experienced Digital IC Design Engineering candidates that will be working on architecting/designing our embedded processor system, related peripheral IP, and mixed-signal design. The design scope includes embedded MCUs, volatile and non-volatile memory, digital signal processing, security features, and industry-standard bus interfaces. This position requires hands-on experience with embedded processors and subsystems, and experience in driving spec, design, and chip implementation. This includes but is not limited to MCU, peripheral IP, volatile/non-volatile memory IP selection, partitioning of hardware/firmware, RTL design, verification, FPGA prototyping, DFT, and IC qualification.
Requirements
- Master’s degree or equivalent in Electrical Engineering with a minimum of 10 years of relevant industry experience
- Hands-on Knowledge and Experience with RISC-V and ARM Cortex-M series MCU subsystem
- Good Experience with architecting and integrating IP in digital logic design
- Hands-on knowledge and good experience with Verilog/SystemVerilog for digital design and verification
- Hands-on knowledge and good experience with Synthesis, Timing Check, and DFT design
- Must have experience in developing digital design in mixed-signal chips that went to volume production
- Excellent oral and written communications skills, writing technical architecture and design documents, communicating with cross-function team
Nice To Haves
- Circuit/Transistor level mixed-signal design experience
- Embedded Flash controller-related design experience
- Digital Security experiences – hash, symmetric and asymmetric encryptions, digital signature,
- Digital Signal Processing
- FPGA mapping or digital design experience
- Interface technologies – USB, I3C
- Programming/scripting skills such as C/C++, Assembly, Python, etc.
- Firmware development experience
- Language fluency in Mandarin
- Design Lead or Project Lead experience
Responsibilities
- Chip architecture, design, and integration: MCU and peripherals, embedded flash and SRAM memory subsystem, on-chip bus system, DMA and interrupt system
- Digital IP RTL design, simulation, and release
- Independently handle complicated design tasks or lead/drive multiple development efforts
- Chip level synthesis, timing check, DFT, and floorplan in a Mixed-Signal Integrated Circuit
- HW/SW partitioning
- Work with firmware team and FPGA team on debugging and emulation
- Work with Product, Test, and Applications Engineering to complete product release
- Work in a multi-site, multi-culture development environment
Benefits
- Renesas offers a full range of elective benefits including medical, health savings account (with applicable medical plan), dental, vision, health and/or dependent care flexible spending accounts, pre-tax commuter benefits, life insurance, AD&D, and pet insurance.
- In addition to elective benefit options, benefited employees receive company-paid life insurance and AD&D, LTD, short term medical benefits as well as paid sick time, paid holidays, and accrued paid vacation.
- New employees will attend a detailed benefit orientation to learn more about our many benefits and resources
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What This Job Offers
Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees
