Principal Adv Packaging Tech Dev Engineer

Broadcom • Irvine, CA

327d • $127,000 - $203,000

About The Position

Seeking an Advanced Semiconductor Package Technology Development expert to drive innovations in advanced substrates, heterogeneous integration with 2.5D/3D assembly and advanced cooling, to support Broadcom's industry leading AI product roadmap and complement our world class IP and Silicon design skills.

Requirements

• Deep knowledge and experience in architectures and process development for 2.5D and 3D Hybrid Cu Bonding integration, advanced FCBGA substrates, and cooling technologies such as microfluidic cooling.
• Advanced knowledge in electrical, thermal and mechanical design aspects of advanced packages, especially for HPC and AI products.
• Extensive experience in reliability testing of advanced packages and sound understanding of the failure modes and mitigation techniques.
• Ability to collaborate with internal and external partners for enhancing process yields and cost effectiveness.
• Demonstrated experience in advanced packaging innovations by means of patents and publications.
• Ph.D. or M.S. in Materials Science, Mechanical Eng, Electrical Eng, or any other microelectronics packaging related field.
• 10+ years of experience in advanced substrates and 2.5D & 3D integration.
• Ability to work in a fast-paced, cross-functional environment with deep thinking and problem solving skills.

Nice To Haves

• Experience with package layout and simulation (electrical / thermal/ mechanical) tools.

Responsibilities

• Lead R&D in advanced substrates, heterogenous integration, and cooling to address the scaling, performance and thermal challenges in our next gen XPU and Networking products.
• Develop novel package and system architectures, in collaboration with our Business Unit experts and industry partners, for transformative advancements in packaging technology that would differentiate Broadcom products.
• Identify, evaluate and qualify advanced materials and fabrication processes to productize new concepts and ideas.
• Design test vehicles, for technology development and qualification, in consideration of product needs and demonstrate the results at appropriate product intercept timelines.
• Work with cross-functional teams within Broadcom and industry partners on planning and execution of development projects.
• Enable the manufacturing ecosystem to implement the qualified technologies in high volume manufacturing.

Benefits

• Medical, dental and vision plans.
• 401(K) participation including company matching.
• Employee Stock Purchase Program (ESPP).
• Employee Assistance Program (EAP).
• Company paid holidays.
• Paid sick leave and vacation time.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Ph.D. or professional degree