Principal Adv Packaging Tech Dev Engineer

Broadcom-posted 9 months ago

$127,000 - $203,000/Yr

Full-time • Senior

Irvine, CA

Computer and Electronic Product Manufacturing

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Seeking an Advanced Semiconductor Package Technology Development expert to drive innovations in advanced substrates, heterogeneous integration with 2.5D/3D assembly and advanced cooling, to support Broadcom's industry leading AI product roadmap and complement our world class IP and Silicon design skills.

Lead R&D in advanced substrates, heterogenous integration, and cooling to address the scaling, performance and thermal challenges in our next gen XPU and Networking products.
Develop novel package and system architectures, in collaboration with our Business Unit experts and industry partners, for transformative advancements in packaging technology that would differentiate Broadcom products.
Identify, evaluate and qualify advanced materials and fabrication processes to productize new concepts and ideas.
Design test vehicles, for technology development and qualification, in consideration of product needs and demonstrate the results at appropriate product intercept timelines.
Work with cross-functional teams within Broadcom and industry partners on planning and execution of development projects.
Enable the manufacturing ecosystem to implement the qualified technologies in high volume manufacturing.

Deep knowledge and experience in architectures and process development for 2.5D and 3D Hybrid Cu Bonding integration, advanced FCBGA substrates, and cooling technologies such as microfluidic cooling.
Advanced knowledge in electrical, thermal and mechanical design aspects of advanced packages, especially for HPC and AI products.
Extensive experience in reliability testing of advanced packages and sound understanding of the failure modes and mitigation techniques.
Ability to collaborate with internal and external partners for enhancing process yields and cost effectiveness.
Demonstrated experience in advanced packaging innovations by means of patents and publications.
Ph.D. or M.S. in Materials Science, Mechanical Eng, Electrical Eng, or any other microelectronics packaging related field.
10+ years of experience in advanced substrates and 2.5D & 3D integration.
Ability to work in a fast-paced, cross-functional environment with deep thinking and problem solving skills.

Experience with package layout and simulation (electrical / thermal/ mechanical) tools.

Medical, dental and vision plans.
401(K) participation including company matching.
Employee Stock Purchase Program (ESPP).
Employee Assistance Program (EAP).
Company paid holidays.
Paid sick leave and vacation time.

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