Power Module Product Engineering

Infineon•San Jose, CA

15h

About The Position

As a Power Module Product Engineering on our Research & Development team, you'll have the opportunity to merge creativity with your technical expertise by shaping the future of technology, driving groundbreaking projects, and bringing new ideas to life.

Requirements

Master’s degree or higher in Electrical Engineering, Materials Science, Microelectronics, or a closely related field
Over 15 years of specialized experience in the semiconductor industry, focusing on Power Modules Demonstrated expertise in product engineering, assembly and packaging development, and failure analysis In-depth knowledge of Power Module design, assembly methods, and packaging processes
Extensive background in stress testing, reliability qualification, and root cause investigation
Hands-on experience with FA laboratories, Design of Experiments (DOE),and material/process characterization
Proficient in both front-end and back-end manufacturing processes
Strong understanding of automotive standards and AEC-Q qualifications
Proven leadership in overseeing cross-functional projects and collaborating with global teams, customers, and suppliers
Exceptional project ownership, organizational abilities, and stakeholder management skills
Excellent communication and presentation capabilities, skilled at articulating complex technical concepts during high-level discussions with internal and external stakeholders Advanced proficiency in data analysis tools including JMP, Python, and Excel Keen analytical mindset, confident decision-making, and a systematic approach to problem-solving

Responsibilities

Actively collaborate with internal and external customers to address complex technical challenges by applying extensive product knowledge through technical liaison, on-site consultations, and comprehensive customer presentations.
Interface with internal and external customers to resolve technical issues requiring in depth product knowledge
Drive design for test and manufacturability, and quality improvement through PPM reduction
Drive corner lot planning including characterization and qualification testing
Drive wafer acceptance test (WAT) to final test specification alignment
Monitor new product design reliability testing, perform interval shift analysis
Some overseas travel may be required for training, product transfers and release