Postdoctoral Researcher

Texas A&MCollege Station, TX
3dOnsite

About The Position

The applicant will be a Postdoctoral Associate/Researcher in the J. Mike Walker ’66 Department of Mechanical Engineering at Texas A&M University working in support of a new DoD funded advanced semiconductor prototyping facility. The researcher will work under the direct supervision of Dr. Dion Antao and work closely with a cluster of faculty (Drs. Cynthia Hipwell, Jonathan Felts, Shoufeng Lan, Matt Pharr and Patrick Samberger) focused on studying thermo-mechanical characteristics of next generation three-dimensional heterogeneously integrated (3DHI) semiconductor based microsystems in a multi-year effort. A researcher in this position will be responsible for designing, assembling and commissioning a modular testbed facility to characterize both transient and steady-state thermal performance characteristics of advanced thermal management technologies for next generation 3DHI microelectronics including (but not limited to) thermal interface materials (TIMs), novel electronics packaging materials and encapsulation compounds, and two-phase cooling solutions capable of efficient 3D thermal transport. Beyond the development of this test facility, a successful candidate will be responsible for interfacing with customers (i.e., industry partners and users of the semiconductor prototyping fab facility) to understand their measurement needs, conducting thermal transport measurements for prototyping facility partners/customers as well as research activites, including designing thermal test vehicles for customer-focused measurements, analyzing research data, and troubleshooting lab equipment. A successful candidate will have the opportunity to collaborate with a dynamic group of researchers (across Mechanical Engineering and Material Science) working on thermal/mechanical characterization of 3DHI microelectronics systems and developing novel thermal management solutions for these 3DHI microsystems, and they will also interact with semiconductor/electronics industrial partners working at the leading edge of 3DHI microelectronics fabrication and packaging. If this description sounds interesting to you, we invite you to apply to be considered for this opportunity.

Requirements

  • Doctoral degree

Nice To Haves

  • Ph.D. in Mechanical Engineering, Materials Science or related field with a focus on thermal-fluid science research.
  • Experience with experimental thermal-fluid transport research or thermal solutions for electronic devices.
  • Demonstrated track-record in experimental (or hands-on) thermal-fluid transport research.
  • Demonstrated experience developing thermal solutions for electronic devices.
  • Experience with LabVIEW programming and equipment integration.
  • Good interpersonal skills, including working with collaborators from different disciplines.
  • Integrative thinking, driven and self-motivated, results oriented, self-awareness, ability to mentor others, and willingness to make changes as required.
  • Deep technical and functional understanding of conduction, convection (natural/passive and forced/active) and radiation under transient/unsteady conditions.
  • Technical and functional understanding of multi-phase (e.g., liquid-vapor and/or solidliquid) thermal-fluid transport phenomena.
  • Knowledge of MATLAB or equivalent toolkit for modelling and data analysis.
  • Knowledge of ANSYS suite and/or COMSOL or equivalent toolkit for modeling of thermo-fluidic characteristics and response.
  • Familiarity with statistical data analysis.
  • Good communication skills.
  • Can produce clear data, presentation material, and deliver clear presentations.
  • Ability to maintain the security and integrity of critical infrastructure, which may include communications systems, computer networks and systems, cybersecurity systems, electrical grid, hazardous waste treatment system or water treatment system.

Responsibilities

  • Design, assemble and commission modular testbed facility to characterize transient and steady-state thermal performance characteristics for 3DHI microelectronics components.
  • Document modular testbed facility design, functions and usage, and develop and deliver training for new graduate/undergraduate students and/or other researchers.
  • Interface with microelectronics industry and academic partners (i.e., customers) to ensure thermal measurements meet their needs.
  • Develop test plans to measure the thermal performance of customer semiconductor packages and customer (or in-house developed) advanced 3DHI microelectronics thermal management solutions using modular testbed.
  • Develop designs of thermal test vehicles and design/set-up test fixtures for thermal transport characterization, drive experiment design and execution, perform data analysis and draw conclusions.
  • Perform transient thermal measurements for 3DHI semiconductor prototyping fab facility customers.
  • Develop and test two-phase thermal management strategies to mitigate identified thermal bottlenecks in 3DHI microelectronics.
  • Mentor thermal graduate students.
  • Write project reports for customers detailing thermal measurements performed, with support of supervisor and other collaborators.
  • Ensure adherence to all safety standards and housekeeping standards within lab and other facility spaces.
  • Other duties as assigned.

Benefits

  • Competitive medical insurance benefits through Blue Cross and Blue Shield of Texas and Prescription coverage by Express Scripts.
  • Options for Vision , Dental , Life , and Long-Term Disability insurance.
  • A defined benefit retirement plan with the Teacher Retirement System of Texas (TRS) with 8.25% employer contribution.
  • Additional Voluntary Retirement Programs: Tax Deferred Account 403(b) and a Deferred Compensation Program 457(b).
  • Flexible spending account options for medical and childcare expenses
  • Generous paid time off with holidays , vacation and sick leave .
  • Robust free training access through LinkedIn Learning plus professional development opportunities .
  • Tuition assistance and Educational release time to further your academic pursuits.
  • Access to Engineer Your Wellness programs that provide opportunities for employees to engage in health and fitness.
  • Wellness release time offered to employees to promote work/life balance.

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What This Job Offers

Job Type

Full-time

Education Level

Ph.D. or professional degree

Number of Employees

1,001-5,000 employees

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