The applicant will be a Postdoctoral Associate/Researcher in the J. Mike Walker ’66 Department of Mechanical Engineering at Texas A&M University working in support of a new DoD funded advanced semiconductor prototyping facility. The researcher will work under the direct supervision of Dr. Dion Antao and work closely with a cluster of faculty (Drs. Cynthia Hipwell, Jonathan Felts, Shoufeng Lan, Matt Pharr and Patrick Samberger) focused on studying thermo-mechanical characteristics of next generation three-dimensional heterogeneously integrated (3DHI) semiconductor based microsystems in a multi-year effort. A researcher in this position will be responsible for designing, assembling and commissioning a modular testbed facility to characterize both transient and steady-state thermal performance characteristics of advanced thermal management technologies for next generation 3DHI microelectronics including (but not limited to) thermal interface materials (TIMs), novel electronics packaging materials and encapsulation compounds, and two-phase cooling solutions capable of efficient 3D thermal transport. Beyond the development of this test facility, a successful candidate will be responsible for interfacing with customers (i.e., industry partners and users of the semiconductor prototyping fab facility) to understand their measurement needs, conducting thermal transport measurements for prototyping facility partners/customers as well as research activites, including designing thermal test vehicles for customer-focused measurements, analyzing research data, and troubleshooting lab equipment. A successful candidate will have the opportunity to collaborate with a dynamic group of researchers (across Mechanical Engineering and Material Science) working on thermal/mechanical characterization of 3DHI microelectronics systems and developing novel thermal management solutions for these 3DHI microsystems, and they will also interact with semiconductor/electronics industrial partners working at the leading edge of 3DHI microelectronics fabrication and packaging. If this description sounds interesting to you, we invite you to apply to be considered for this opportunity.
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Job Type
Full-time
Education Level
Ph.D. or professional degree
Number of Employees
1,001-5,000 employees