Postdoctoral Appointee - Electron Microscopy for Microelectronics

Argonne National Laboratory • Lemont, IL

77d • $70,758 - $117,925

About The Position

Argonne’s Nanoscience and Technology Division seeks a postdoctoral scientist to advance transmission electron microscopy (TEM) studies of materials and interfaces relevant to microelectronics. Working within the Center for Nanoscale Materials (CNM), the successful candidate will leverage state-of-the-art functional and dynamic TEM capabilities to lead experimental research on defect species, distributions, and dynamics in metallic, oxide, and semiconducting systems. This project integrates high-throughput and in situ TEM experimentation with AI/ML-driven image analysis and computational modeling to uncover mechanistic insights into defect migration and functional properties. The work will be performed in close collaboration with experts in microelectronics materials and devices, materials characterization, computational modeling, and artificial intelligence across multiple academic and national laboratories.

Requirements

• Recent or soon-to-be-completed Ph.D. (0–5 years) in materials science, physics, electrical engineering, or a closely related field
• Strong background in scanning/transmission electron microscopy (S/TEM), including atomic-resolution imaging, EELS, and EDS; experience with cathodoluminescence (CL) and electron-beam induced current (EBIC) imaging is a plus
• Experience with TEM specimen preparation via FIB and/or nanofabrication techniques (photolithography, e-beam lithography)
• Proficiency in programming (e.g., Python) for experiment automation and/or image analysis; experience with machine learning is a plus
• Demonstrated record of peer-reviewed publications

Nice To Haves

• Experience with electronics, including electrical measurements relevant to microelectronics devices
• Background in metals, oxides, semiconductors, and/or 2D materials

Responsibilities

• Design and execute S/TEM imaging and spectroscopy, including in situ studies (e.g., EELS, EDS) to probe defect structures and dynamics
• Apply advanced image processing and analysis; develop AI/ML workflows for quantitative defect characterization
• Implement high-throughput and automated TEM specimen preparation, including focused ion beam (FIB) methods
• Curate and prepare datasets for AI model training, validation, and inference
• Disseminate findings through high-impact publications and presentation

Benefits

• Comprehensive benefits are part of the total rewards package

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Education Level: Ph.D. or professional degree
• Number of Employees: 1,001-5,000 employees