Physical Design Engineer

AlteraSan Jose, CA
44d

About The Position

About the Role: As a Physical Design Engineer at Altera, you will play a critical role in the backend implementation flow — from RTL/netlist through GDSII/tape-out for FPGA/SoC devices. You will collaborate with architecture, logic design, DFT, CAD/EDA, and manufacturing teams to achieve performance, power, and area (PPA) goals, with a particular emphasis on programmable logic structures, block and full-chip integration, and the unique demands of FPGA technologies (e.g., configurable logic blocks, routing fabrics, I/O rings, on-chip power domains).

Requirements

  • Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field with 6+ years of experience in:
  • Hands-on digital/SoC physical design (synthesis through P&R and sign-off).
  • Industry-standard EDA tools (e.g., Synopsys IC Compiler/Fusion, Cadence Innovus/Encounter, PrimeTime, STAR-RCX, Calibre) for high-speed digital ASIC/SoC implementation.
  • Scripting/programming (TCL, Python, Perl, shell) for flow automation and productivity enhancement.
  • Physical design flow: floorplanning, CTS, placement, routing, power domain gating, clock domain crossing, multi-power domain design, timing closure, ECOs, and DRC/LVS/DFM resolution.
  • Power/IR analysis, signal/power integrity reporting, and corrective action planning.
  • Interfacing with front-end teams (RTL, architecture), CAD/EDA tool teams, and manufacturing/packaging teams.

Nice To Haves

  • Experience with advanced process nodes (7nm, 5nm or smaller) or FPGA/programmable logic device flows.
  • Familiarity with FPGA architecture: routing fabrics, programmable logic blocks (PLBs), on-chip networks, I/O rings, static/dynamic reconfiguration.
  • Expertise in low-power design methodologies, power grid design, power gating, multi-voltage domain implementation, and power sign-off flows.
  • Prior exposure to full-chip integration flows (block-to-chip convergence) and high-frequency (1 GHz+) timing closure.
  • Experience in high-volume manufacturing environments, including yield and DFM/DFY considerations.
  • Experience mentoring or leading small physical design sub-teams or owning major P&R blocks.

Responsibilities

  • Execute physical design implementation tasks (floorplanning, power planning, placement, clock tree synthesis (CTS), routing, engineering change orders (ECO), extraction, sign-off preparation) from netlist to GDSII.
  • Apply PPA optimization techniques (performance/timing closure, power reduction, area efficiency) across block-level and full-chip hierarchies.
  • Collaborate with front-end design, architecture, and CAD/EDA tool teams to ensure physical design constraints, timing budgets, power budgets, and DFT insertions are met.
  • Develop and enhance physical design flows, methodologies, scripts, and automation frameworks (TCL, Python, Perl) to accelerate turnaround, improve QoR, and reduce manual intervention.
  • Participate in timing, power, EM/IR integrity, signal/power noise, and DRC/LVS/ERC verification for sign-off readiness.
  • Integrate FPGA-specific physical design aspects: configurable logic block placement, fabric routing, I/O ring optimization, power domains for programmable regulation, and yield optimization.
  • Debug physical design issues and interact with CAD tool vendors and internal tool teams to drive tool enhancements or workarounds.
© 2024 Teal Labs, Inc
Privacy PolicyTerms of Service