Photonics Mechanical Design Engineer, Senior

MACOM Technology Solutions Holdings, Inc. • Hillsborough Township, NJ

3d • $85,000 - $120,000

About The Position

Technical lead supporting new product introductions from concept through production release. This individual will provide critical design input to RF and/or photonics product and design engineers for optimum, cost-effective mechanical solutions. This individual may be required to lead multiple product development projects in parallel to deliver opto-mechanical package and enclosure solutions (modules) on schedule for prototyping and manufacturing.

Requirements

• Knowledge of high-volume RF and photonics packaging assembly/test processes.
• In depth understanding of a variety of optical networking devices such as lasers, modulators, detectors, WDM, optical fibers, and control electronics.
• Experience in successfully driving design/development/characterization activities from concept to implementation.
• Ability to lead independent process development efforts and provide suppliers direction by working with design, assembly, and quality organizations.
• Experience with solving steady state and dynamic thermal and mechanical problems, using finite element analysis (FEA) and computational fluid dynamics (CFD) software.
• Knowledge of product characterization, testing, quality, and reliability, including compliance testing and certification.
• Experience in process troubleshooting, failure analysis and Six Sigma methodologies.
• Ability to work under tight deadlines, with strong ownership of projects.
• Ability to work effectively in a multi-project mode.
• Good written and verbal communication skills. Able to present ideas, design concepts, data and plans with high confidence at team meetings and business group review meetings.
• Good teamwork skills in working together to achieve goals.
• MS or BS in Mechanical Engineering or similar studies.
• Minimum of 10 years of experience in relevant design engineering with process development and design/emphasis on electronic assemblies.
• Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.
• Must be able to obtain a security clearance.

Nice To Haves

• Experience with AutoCAD and/or SolidWorks is desired.
• Fluent with Microsoft Office products.

Responsibilities

• Technical lead for developing mechanical/manufacturing solutions in RF and photonics module and enclosure development.
• Work with internal Product Design, QA, Reliability, Supply chain and external suppliers to develop, apply and qualify the appropriate packaging technologies and assembly processes, with focus on cost, manufacturability, yield, and quality.
• Work with Design, Program Management and Material Planning to plan and establish Engineering Build Requirements and Qualification Build Requirements for new product introductions.
• Collaborate with vendors and internal engineering resources to establish and update design rules for packaging.
• Perform design reviews to ensure adherence to DFM guidelines.
• Establish and implement robust assembly processes internally and at contract manufacturers.
• Working with Quality organization, characterize failure modes and analyze as a function of packaging materials and processes. Troubleshoot packaging and assembly defects, then define and implement solutions.
• Design/Develop tooling for high volume, high mix processes.
• Establish application notes for new products.

Benefits

• Health, dental, and vision insurance.
• Employer-sponsored 401(k) plan.
• Paid time off.
• Professional development opportunities.
• This position is eligible to receive restricted stock unit (RSU) awards and cash bonuses, solely at MACOM’s discretion, subject to individual and company performance.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 501-1,000 employees