Photonic Integrated Circuit (PIC) Test and Characterization Engineer (Associate or Mid-Level)
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About The Position
Boeing Research & Technology (BR&T) is currently looking for a Photonic Integrated Circuit (PIC) Test and Characterization Engineer (Associate or Mid-Level) to join the team based in Huntington Beach, CA. We are Boeing Research & Technology (BR&T): Boeing's global research and development team creating and implementing innovative technologies that make the impossible possible and enable the future of aerospace. We are engineers and technicians, skilled scientists and bold innovators: join us and put your passion, determination, and skills to work building the future! Within BR&T, Boeing’s RF, Photonics, and Mixed-Signal Microsystems organization (RPMM) performs microelectronics and photonics technology development for aerospace systems. RPMM develops cutting-edge components including digital, analog, and RF Systems on Chip (SoCs), as well as Photonic Integrated Circuits (PICs) for radar, navigation, electronic warfare, communications, processing, sensing, and other critical functions. These systems are used on Boeing airborne, terrestrial, and satellite platforms. Designs leverage state-of-the-art semiconductor and photonic process technologies. While RPMM utilizes external wafer fabrication services, it executes the whole development flow in-house including architecture definition, design, layout, verification, packaging, and testing. RPMM owns numerous projects funded by internal Boeing programs and external U.S. Government Science and Technology (S&T) customers.
