Photolithography Process Development Engineer

Micron Technology•Boise, ID

About The Position

Lead a particular module within next generation storage device. Develop new, manufacturing friendly photolithography processes that enable the physical and electrical architecture with lithography technology, including 365, 248, and 193 immersion lithography. Engage with equipment/material vendors on new solutions to overcome process challenges. Innovate new design, layout, and photolithography techniques to open a solution space for building future generations of memory devices. Review all types of literature to identify potential intellectual properties (IP) opportunities and file disclosures. Use data analysis, and/or machine learning to identify root cause by correlating device failure with process conditions. Data may include critical dimension, registration, cross section, etc. Document and communicate plans, status, and results of projects in written reports and presentations.

Requirements

5+ years of Photolithography experience!
Strong skills for research and development, and ability to build manufacturing-friendly technologies.
Understanding optics to include the principles and application of immersion lithography, polarized illumination, and low k1 imaging.
Experience with chemical process specific to lithography, including materials for 365, 248, and 193nm lithography.
Understanding of material properties and characterization techniques of lithography.
Ability to work well with others in a highly collaborative environment, as well as independently with strong sense of ownership.
Excellent analytical skills.
Strong communication skills (written, verbal and presentation).
Required Education: PhD and 3 years of relevant industry experience, OR a Master's degree and 5 years of relevant industry experience OR a Bachelor's Degree and 7+ years of relevant industry experience.

Nice To Haves

Data science and programming experience/coursework are strongly preferred.
Coursework or experience in photolithography and semiconductor manufacturing preferred.
Experience with photolithography simulation software is a plus.

Responsibilities

Lead a particular module within next generation storage device.
Develop new, manufacturing friendly photolithography processes that enable the physical and electrical architecture with lithography technology, including 365, 248, and 193 immersion lithography.
Engage with equipment/material vendors on new solutions to overcome process challenges.
Innovate new design, layout, and photolithography techniques to open a solution space for building future generations of memory devices.
Review all types of literature to identify potential intellectual properties (IP) opportunities and file disclosures.
Use data analysis, and/or machine learning to identify root cause by correlating device failure with process conditions.
Document and communicate plans, status, and results of projects in written reports and presentations.

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