Photolithography Process Development Engineer (Advanced Patterning)

Texas Instruments • Lehi, UT

9h

About The Position

Change the world. Love your job.

We’re at the forefront of an exciting era of semiconductor innovation at Texas
Instruments’ LFAB in Lehi, Utah — home to our state-of-the-art 300mm
manufacturing facility now ramping our most advanced 28nm analog and embedded
process technology in the heart of the Silicon Slopes. As part of our Advanced
Technology Development (ATD) organization, you will be challenged with
developing and characterizing the next generation node.  We are seeking a highly
skilled and hands-on Process Development Engineer with deep expertise in
advanced-node semiconductor manufacturing. This role focuses on the next
generation 20nm-class logic technologies, with primary responsibility
for photolithography and litho-etch integration, including advanced patterning
techniques such as pitch doubling (SADP/LELE).  This role will also work
directly with the Resolution Enhancement Techniques (RET) team to create Optical
Proximity Corrections (OPC) and validate final pattern meets design tolerance.  

You will play a critical role in developing, optimizing, and scaling patterning
processes to meet aggressive performance, yield, and manufacturability targets.
This is a high-impact position working at the intersection of lithography,
materials science, and plasma etch.

Responsibilities

• Utilize lithography simulation software (e.g., Prolith, S-Litho) to analyze process windows and optimize patterning results.
• Utilize advanced metrology (CD-SEM, Overlay, Scatterometry) to identify defects and improve Critical Dimension Uniformity (CDU) and overlay performance.
• Work with equipment vendors to evaluate new materials, photoresists, and tool hardware upgrades.
• Analyze process data, identify root cause, and implement robust process improvements.  Apply Statistical Process Control (SPC) and Design of Experiments (DOE) to develop new processes to enable Litho shrink processes.
• Define pathfinding activities for new patterning technology, evaluating High NA Immersion for next-generation nodes. Lead technology transfer from R&D to HVM for photolithography processes.
• Lead development to create next generation Litho Shrink processes for 20nm class logic nodes.
• Drive litho-etch integration (LE, LELE, SADP / pitch doubling) for advanced patterning schemes.
• Develop and implement resolution enhancement techniques (RET) and optical proximity correction (OPC)strategies.
• Evaluate and select materials systems, including photoresists, hard masks, and anti-reflective coatings.
• Characterize and reduce patterning defects, including line edge roughness (LER), CD variation, and overlay errors.
• Collaborate closely with Etch team to optimize pattern transfer, profile control, and CD uniformity Interface with cross-functional teams including design, integration, yield, and manufacturing.

Benefits

• Engineer your future. We empower our employees to truly own their career and development. Come collaborate with some of the smartest people in the world to shape the future of electronics.
• We're different by design. Diverse backgrounds and perspectives are what push innovation forward and what make TI stronger. We value each and every voice, and look forward to hearing yours.
• Benefits that benefit you. We offer competitive pay and benefits designed to help you and your family live your best life. Your well-being is important to us.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: No Education Listed
• Number of Employees: 5,001-10,000 employees