PCB Manufacturing Engineer, Quantum AI

Google•Goleta, CA

About The Position

In the Device Packaging Group, we build custom packaging technologies for quantum processors, amplifiers, and other devices that operate from Direct Current (DC) to microwave frequencies in a cryogenic environment. Your work includes research on quantum processor performance and qubit environment, design of novel packages and test articles, investigation of new technologies, and hardening of current technologies for deployment. as every Google Quantum AI processor comes through our lab for packaging before its deployment to the fleet. As a Manufacturing Engineer, you will help ensure that Google Quantum AI’s quantum computing systems can be built efficiently and operate reliably, ensuring a high velocity for research and development on quantum platforms. You will design manufacturing, assembly, and related test processes. You will also implement Design for Manufacturing (DfM) and Design for Test (DfT) practices for Printed Circuit Board (PCB) based electronics, microwave components, and mechanical hardware. You will seek opportunities to graduate in-house procedures to productionize manufacturing, continuously improve the lead-time and quality performance of key partners, and provide technical input for our supplier strategy.The full potential of quantum computing will be unlocked with a computer capable of error-corrected computations. Google Quantum AI's mission is to build this computer and unlock solutions to classically intractable problems. Our roadmap is focused on advancing the capabilities of quantum computing and enabling meaningful applications.

Requirements

Bachelor’s degree in Mechanical, Electrical, or Manufacturing Engineering or equivalent practical experience.
2 years of experience working with electronics packaging, including wire bonding, die preparation, or printed circuit boards (PCBs).
2 years of experience designing, manufacturing, or testing PCBs.
2 years of experience managing production processes (vendor management, continuous process improvements, tool ownership, or monitoring and control of existing processes).
Experience using statistical process control (SPC) and design of experiments (DOE) to develop or improve manufacturing processes.

Nice To Haves

Master's degree in Mechanical, Electrical, or Manufacturing Engineering or a related field.
2 years of experience in a semiconductor packaging environment.
Experience with Electrostatic Discharge (ESD) sensitive devices.
Experience with automated inspection and test.
Experience in wirebonding processes (e.g., ball, wedge).
Knowledge of Six Sigma or other lean manufacturing methodologies.

Responsibilities

Develop, characterize, document, and scale manufacturing processes for the packaging of quantum computing devices.
Operate, maintain, and troubleshoot key manufacturing equipment.
Lead Vendor management (Failure Analysis/Root Cause Corrective Action (RCCA), improve yield and throughput, manage custom workflows, etc.).
Implement and improve internal production processes (including wire bonding, work instructions/procedures, design and build fixtures/jigs, inspections, data hygiene, automation, technician training).
Lead root cause analysis investigations for manufacturing failures and implement effective corrective and preventive actions.