Hadrian is building autonomous factories that help aerospace and defense companies manufacture rockets, satellites, jets, and ships up to 10x faster and up to 2x cheaper. By combining advanced software, robotics, and full-stack manufacturing, we are reinventing how America produces its most critical parts. Valued at $1.6B, we’re accelerating our mission with the launch of Factory 3 in Mesa, Arizona, a 290,000-square-foot facility creating 350 new jobs. We are expanding rapidly to support thousands of future hires, launching Hadrian Maritime to expand into naval production, and introducing a Factory-as-a-Service model that delivers complete systems instead of individual parts. Hadrian is backed by leading investors including T. Rowe Price, Lux Capital, Founders Fund, and Andreessen Horowitz, our fast-growing team is united around reindustrializing American manufacturing for the 21st century and beyond. Join Us in Advancing PCB Manufacturing We are building advanced printed circuit board (PCB) manufacturing capabilities by integrating materials science, precision fabrication, and high-throughput assembly into a unified production system. From substrate preparation and layer stackup through imaging, plating, assembly, and validation, we treat PCB manufacturing as a tightly controlled, multi-step process where chemical, mechanical, and electrical variables must align. We are solving complex challenges across fabrication, surface treatment, assembly, and inspection. This requires engineers with deep expertise in PCB processes who can operate across both fabrication and assembly environments. This is a general opportunity to engage PCB engineers with specialized experience across key process areas. Core Specialty Areas PCB Fabrication & Layer Stackup: Layup, lamination, book stacking/debooking, dry film application, imaging Drilling & Via Formation: Mechanical drilling, laser drilling, X-ray drilling, via fill, desmear Plating & Metallization: Copper plating, direct metallization, surface pretreatment, planarization Etch & Pattern Transfer: Develop / etch / strip processes, soldermask application, screen printing Surface Finishes & Coatings: OSP, ENIG, HASL, ENEPIG, conformal coating Assembly & Interconnects: SMT assembly, connector soldering Inspection & Test: AOI (Automated Optical Inspection), electrical test/rework, X-ray inspection Material & Process Support Systems: Chemical analysis labs, mechanical analysis labs, ultrapure water systems, wastewater treatment Secondary & Finishing Operations: Routing, deburring, preclean, mylar peel
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
101-250 employees