About The Position

We are the global test and automation specialists, powering next-generation technologies through sophisticated solutions. Behind every electronic device you use, Teradyne's test technology ensures your device works right the first time, every time! Our portfolio of automation solutions help manufacturers to develop and deliver products quickly, efficiently and cost-effectively. Together, Teradyne companies deliver manufacturing automation across industries and applications around the world! We attract, develop, and retain a high-performance workforce, comprised of people with diverse backgrounds and a shared drive for excellence. We strive to foster a positive and inclusive work environment that helps employees, and communities, thrive. Our Purpose TERADYNE, where experience meets innovation and driving excellence in every connection. We are fueled by creativity and diversity of thought and in our workforce. Our employees are supported to innovate and learn something new every day. We cultivate a culture of inclusion for all employees that respects their individual strengths, views, and experiences. We believe that our differences enable us to be a better team - one that makes better decisions, drives innovation and delivers better business results. Opportunity Overview The HW Interface Engineer serves as the engineering authority within the Solution Engineering Group, mentoring internal field teams, conducting critical HW Interface design reviews, and ensuring technical consistency across vendor-developed solutions. This role ensures that schematic, layout, and simulation reviews are conducted with rigor and consistency, particularly for strategic projects in high growth market such as High Power Computing and AI with technical governance and standardization.

Requirements

  • BSEE or equivalent required; MSEE preferred (EM/high speed a plus).
  • 8-12+ years in high speed PCB/DIB design, SI/PI
  • High-speed SI/PI expertise for complex DIB/load-boards: stack-ups, loss/crosstalk budgets, return-path control, via strategy, PDN target-Z, decoupling.
  • PCB governance: constraint sets, DFM/DFA/DFT, panelization, coupons, controlled impedance.
  • Mechanical/thermal integration: fixtures, tolerances, stiffness, thermal paths.
  • EDA & simulation fluency: Allegro/OrCAD or Xpedition; Sigrity/HyperLynx; interpret S-parameters, eye/BER, TDR/TDT.
  • Vendor technical governance: capability assessment, allocation, corrective actions, QBR metrics.
  • Mentoring & communication skills; ability to drive standards adoption.

Nice To Haves

  • IPC CID/CID+ and/or major EDA SI/PI certifications are a plus.
  • Knowledge of Teradyne UltraFLEX test equipment is a plus

Responsibilities

  • Lead and facilitate schematic, layout, and mechanical design reviews for vendor-developed hardware interfaces.
  • Validate simulation results and ensure signal integrity, mechanical constraints, and manufacturability are addressed.
  • Compare vendor capabilities to guide onboarding, project allocation, and quarterly reviews.
  • Define and maintain technical standards for DIB design, including layout rules, signal routing, and mechanical part usage.
  • Create and manage shared templates and documentation frameworks to ensure consistency across vendors.
  • Mentor field engineers and internal stakeholders on best practices for reviewing vendor designs.
  • Act as the technical reference for high-impact projects requiring elevated scrutiny and rapid turnaround.
  • Contribute to the DIB technology roadmap and innovation initiatives.

Benefits

  • Teradyne offers a variety of robust health and well-being benefit programs, including medical, dental, vision, Flexible Spending Accounts, retirement savings plans, life and disability insurance, paid vacation & holidays, tuition assistance programs, and more.

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What This Job Offers

Job Type

Full-time

Career Level

Mid Level

Industry

Computer and Electronic Product Manufacturing

Number of Employees

5,001-10,000 employees

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