Cisco is seeking a seasoned Silicon Photonics Packaging Technical Leader to lead the development and integration of advanced packaging solutions for silicon photonics (SiPh) products. This individual will provide technical leadership by driving innovation in 2.5D/3D packaging, collaborating with internal design teams and OSATs and ensuring manufacturability and reliability at scale. This role offers significant scope, cross-organizational visibility, and the potential to shape critical technology development and influence long-term product platforms.
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Job Type
Full-time
Career Level
Mid Level