Microsoft's Quantum research group is exploring ways to build a full-stack quantum computer and has become the world's center of expertise on topological quantum computing. The research effort includes theoretical and experimental teams around the world, who have been designing and optimizing all aspects of the quantum computer, from topological qubit designs to cryogenic control and readout circuitry, to runtime software and quantum language compilers. At Microsoft Quantum, we aim to empower science and scientists to solve the world's biggest problems by realizing advanced computing platforms at the intersection of high-performance computing, artificial intelligence, and quantum information technology. Microsoft Quantum will change the world of computing and help solve some of humankind's currently unsolvable problems. We are looking for a Packaging Failure Analysis Engineer with a focus on hands-on failure and materials analysis and process development. Responsibilities will include driving failure analysis of a variety of devices associated with the quantum hardware program. It will require the development and adaptation of measurement and characterization processes, the use of numerical modelling, and the processing of generated data to support the overall failure analysis mission. You will be working with a diverse team of engineers and scientists on assembling and scaling complex quantum hardware devices.
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Job Type
Full-time
Career Level
Mid Level
Industry
Professional, Scientific, and Technical Services
Education Level
Master's degree