Packaging Engineering Intern MS/PhD

Texas Instruments

97d

About The Position

Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products. Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness. Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization. TI's innovative packaging technologies are designed to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power.

Requirements

• Pursuing a degree in Engineering or related field.
• Familiarity with semiconductor packaging technologies.

Nice To Haves

• Experience with cross-functional team collaboration.
• Knowledge of material characterization techniques.

Responsibilities

• Interface across various work areas and organizations for semiconductor packaging technologies.
• Participate in cross-functional teams to develop solutions for semiconductor packaging.
• Work on Wirebond, Flip Chip, Modules, SIPs, and other advanced packages.
• Cultivate packaging advancements through material, mechanical, thermal, and electrical characterization.

What This Job Offers

• Career Level: Intern
• Education Level: Bachelor's degree
• Number of Employees: 5,001-10,000 employees