Packaging Customer Engineer

Intel Corporation • Santa Clara, CA

1d • Onsite

About The Position

Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain.The IFS Packaging and Test Business GroupPackaging is a critical revenue enabler for IFS and a key part of Intel's forward-looking strategy. IFS Packaging Test Business Group has been created to develop, grow, and execute a robust packaging roadmap.The primary responsibilities for the Packaging Customer Engineer will include but are not limited to: Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer.Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments.Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.Represent the customer in internal technology working groups for new technologies during pathfinding and development.This position deals with a high level of both technology and market/business ambiguity and future uncertainties. In addition, this person will be frequently interacting and making recommendations to Intel VPs and Corporate VPs and will need to be conversant and knowledgeable in both internal roadmaps and external industry trends.In this role you will need the following attributes:Strong problem solving, analytical, and communication skills.Have demonstrated the ability to plan and manage projects.Extensive knowledge of Intel packaging development and manufacturing capabilities.Experience in ATTD and Competitor packaging roadmaps.Experience with product architecture floor plans, IP development cycles, and their dependency on package design and architecture.Be able to work independently in a highly matrixed structure with extensive experience presenting to Senior Management (VP and Corporate VP Level).

Requirements

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM field.
• 9+ years of experience in semiconductor packaging
• Hands-on experience in one or more of the following areas: Power delivery High‑speed signaling Thermal‑mechanical analysis Process development Die disaggregation architectures
• Experience presenting technical information to external customers and suppliers.

Nice To Haves

• Master’s or Ph.D. in Electrical Engineering, Computer Engineering, Computer Science, or a related STEM discipline.
• Strong knowledge of Intel packaging technologies.

Responsibilities

• Collaborate with IFS Customer product design, internal product design, Silicon process development, Intel's Assembly Test Technology Development (ATTD), and Product Engineering teams to drive product architecture definition, product package design and execution.
• Serve as the engineering interface to IFS Customers for packaging services to promote Intel packaging technologies, to perform technical feasibility and risk assessments, to analyze product ask vs. the ATTD packaging roadmap and to close the deal with the customer.
• Drive Customer-facing technology reviews as the key engineering interface between the Customer and Intel Foundry, owning the Customer packaging engineering relationship from product concept through product mass production.
• Work with IFS Business Development, ATTD, ATM and Supply Chain to complete RFQ risk assessments and pricing assessments.
• Capture customer feedback and competitive trends that can better inform the ATTD packaging roadmap.
• Represent the customer in internal technology working groups for new technologies during pathfinding and development.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level