Package Layout Designer (Substrate)

ZP Group•Saratoga, CA

25d•$140,000 - $165,000•Onsite

About The Position

Piper Companies is hiring a Package Layout Designer (Substrate) for a small start up based in Saratoga, CA. The Package Layout Designer (Substrate) will be driving the entirety of the layout to come up with a conclusion for this packaging and design the physical layout for package substrate technology. The Package Layout Designer (Substrate) will need to sit on site 5 days per week in Saratoga, CA and this is a 4-6 month contract opportunity with potential to extend.

Requirements

6+ Years of experience designing the physical layout design for package substrate technology
Expertise in layout design work
Experience working with ASIC, Signal and Power Teams
Advance Knowledge in Allegro Cadence APD, Siemens (Xpedition) and AutoCAD design tools

Responsibilities

Drive high-density substrate designs for advanced multi-die packages
Plan bump maps, escape routes, vias, and layer stack-ups
Work with ASIC, Signal, Power Teams to make sure the escape routes and breakouts from the silicon package is okay
Assess routing feasibility with respect to die layout and mechanical constraints
Align floor planning with system, packaging, and mechanical teams
Optimize signal, power, and ground integrity through smart routing
Perform DRC, DFM, and manufacturing rule checks
Finalize design packages and coordinate with substrate vendors
Support layout reviews and incorporate stakeholder feedback