Package Layout Design Senior Staff Engineer

Marvell Technology•Austin, TX

About The Position

About Marvell Marvell’s semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, and carrier architectures, our innovative technology is enabling new possibilities. At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead. Your Team, Your Impact The Marvell Advanced Packaging team is responsible for supporting customers with package designs that meet challenging electrical requirements. High speed signaling and challenging power delivery networks require complex and custom solutions to meet constantly advancing application needs. Many of the new designs require multi-chip and multiple component configurations with high-speed IP requirements. In addition, our team is advancing Marvell's expertise in 3D packaging, Co-packaged optics and cutting-edge substrate materials. We work with the world's leading manufacturers to solve our client's most challenging designs and integrations with industry-leading packaging techniques. The ideal candidate will have an interest in hardware design and experience working on signal and power integrity verification and design optimization. A knowledge of Electrical Engineering concepts, circuit extractions and simulation, as well as design methodology and strategies is required

Requirements

Experience with 2.5D package design and development
Using IC package layout tools like Cadence APD or Mentor XPD
Understanding IC package design requirements for high speed interfaces and setup constraints manager
Interface with the IC physical design teams for optimizing the ASIC die floor plan
Experience in interfacing with Substrate suppliers, OSATs and Silicon fab vendors
Experience in working with IC package assembly development teams and understanding assembly requirements
Experience with IC layout tools is highly desired
Ability to do automation of the layout tasks using scripting
Power plane design and translating power supply requirements into design
Familiarity with IC packaging technologies, materials, substrate design rules and assembly rules
Track record of new product introduction from concept through development and production is a plus
Knowledge of the thermal and mechanical analysis of the IC package development is a plus
A team player with strong communication, presentation, and documentation skills
Bachelor’s degree in Computer Science, Electrical Engineering or related fields and 5 - 8 years of related professional experience or Master’s/PhD in Computer Science, Electrical Engineering or related fields with 1-3 years of experience