Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. At Applied Materials’ CTO office, we are developing optical interconnect solutions for the next generation hyperscale computing and AI/ML. You will be working with a highly capable international team to develop advanced photonics packaging solution. You will lead optomechanical design, optical sub-assembly design, micro optics, fixture and tooling development. Those fixtures and tooling are expected to achieve micron level assembly accuracy. You are also expected to design / develop multi-fiber optical connectors and work with external vendors to develop connector eco-system. You are also expected to be familiar with various materials used in photonics industry, including but not limited to: glass, epoxy, silicon and other related materials. You daily activities includes working with 3D solid models, drawings, and documentation utilizing GD&T principles; performing tolerance analyses for precision alignment, performing thermal, structural/stress, and vibration analyses; assessing designs against environmental requirements; as well as conducting test and verification efforts. With a product focus, the individual will actively partner with other engineering disciplines and operations personnel to develop solutions that adhere to DFT and DFM requirements.