This is an exciting opportunity to contribute to the Sensitivity and Throughput Roadmap for both BBP and Rapid Divisions. BBP (Broadband Plasma) Division provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Rapid Division provides market-leading reticle inspection solutions for the semiconductor industry. In this role, you will be working with Research Scientists, Optics Engineers and other Mechanical Engineers to develop R&D Inspection Benches to validate new inspection methods that could drive the future of both BBP and Rapid divisions. These R&D Inspection Benches would be utilized to run actual inspections on customers wafers and reticles in order to validate the values of the proposed new inspection methods. The inspection results from these R&D benches will determine the adoption/implementation on the actual systems/products, thus the roadmap. In this role you will: Obtain thorough understanding of the fundamental physics behind the new proposed inspection methods and the underlying problems these new methods are aimed to solve. Work together with Optics Engineers to develop the layout, followed by design concepts and detailed designs to build these R&D Inspection Benches from scratch. Work together with Optics Engineers to perform optical alignment on these benches. Own driving the precision mechanism design, vibration control and other related design parameter to meet bench requirements (such as cleanliness) that are critical for the wafer and reticle inspection systems. Own driving selections of key modules such as light source, optics, sensors/cameras, stages. Work together with Research Scientists to run actual inspections on customers wafers and reticles on these benches. Communicate results and recommendations to Product teams and Marketing.
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Job Type
Full-time
Career Level
Mid Level
Education Level
Ph.D. or professional degree
Number of Employees
5,001-10,000 employees