Operations Excellence Intern - Lean Manufacturing

Halo Industries, Inc.•Santa Clara, CA

8h•$20 - $25

About The Position

Join Halo Industries and be part of a company that's transforming the semiconductor industry with our innovative laser technology. Founded in 2014 and supported by significant funding as of 2024, we're focused on creating efficient solutions that dramatically reduce waste and improve material performance across various sectors such as automotive, telecommunications, and power electronics. The Opportunity Halo is transitioning from a startup to a high-volume manufacturing facility for Silicon Carbide (SiC) wafers. As our Ops Excellence Intern, you will be the primary architect for validating how SiC wafers travel from raw ingots to finished substrates and help optimize WIP flow, capacity, and reduce cost. You will use data-driven insights to identify bottlenecks and opportunities through Six Sigma methodologies like Value Stream Mapping and set up scalable models for Capacity, Throughput, and Cycletime. You will help validate and improve our Operation Method Sheets (OMS) and eliminate waste across the entire process.

Requirements

Currently pursuing a BS/MS in Manufacturing Engineering, Industrial Engineering, Operations Research, or other Engineering degree.
Understanding of Lean Manufacturing, you have a desire to expand your knowledge from the classroom to the real world applications of Six Sigma Lean methodologies.(VSM, 5S, Kaizen, etc).

Nice To Haves

Hands On Mentality: Exceptional observational skills and a "boots-on-the-ground" mentality for data collection, collaboration, and project execution.
Communication: Clear communication skills for collaborating with both PhD scientists and production technicians. Good technical writing and ability to present data and create visual training content related to your project with photos, diagrams, videos and interactive content.
Systems Thinker: You enjoy connecting the dots between different software platforms (MES, PLM, LMS) to create a seamless user experience.

Responsibilities

Lean Manufacturing Optimization:
Value Stream Mapping (VSM): Develop a "cradle-to-grave" map of our SiC manufacturing flow to visualize lead-time drivers and identify process friction.
Extended Time Studies: Conduct longitudinal studies across shifts, from incoming ingot characterization to post wafer CMP polish, to establish precise baseline capacities and model them in our MES.
OMS Validation: Audit our Operation Method Sheets against real-world floor execution to ensure documentation matches actual high-tech fabrication practices.
Process Optimization: Identify "Muda" (waste) in operator movements or tool idle times and pitch data-backed improvements to the Director of Operations.
Best Practice Synthesis: Partner with senior technicians to capture tribal knowledge and codify it into standardized, high-efficiency workflows.
Model Development: Improve models for Cycle Time, Capacity, and Throughput so they are scalable across time as we grow in volume.
Training and Validation Platform:
OMS Standardization: Lead a site-wide project to update all Operation Method Sheets (OMS) to a common, highly visual structure. You’ll ensure every document includes specific Eyelit MES step references and error-proofing (poka-yoke) instructions.
Competency Framework: Define the training plan for each critical process. This includes developing quiz and test requirements to validate that operators aren't just "reading" a document but demonstrating true competency.
Systems Integration: Execute the digital linkage between Arena PLM and the Eyelit Operator Certification module. You’ll ensure that when a procedure is updated in Arena, the training requirement is automatically triggered.
Certification Validation: Configure the "hard gates" within Eyelit MES. Your goal is to ensure the system physically prevents an operator from starting a lot if their certification is expired or missing.
Audit Readiness: Organize the training matrix to be "always-audit-ready," ensuring that all competency records are instantly retrievable and linked to the specific version of the OMS in use on the floor.
Pack-out- Ship-out Optimization:
Shipping Optimization: Define and document best practices for SiC protection, including Desiccant Packaging, Nitrogen (N2) Backfill, and Double Bagging protocols within a cleanroom environment.
Product-Specific Requirements: Differentiate packaging needs for Epi-ready substrates (ultra-low particle counts) versus CMP-ready products, ensuring each has a tailored protection strategy while optimizing cost.
Design of Experiments (DOE): Conduct rigorous experiments to validate new packaging methods against our current Plan of Record (POR). You’ll use surface inspection tools to monitor for Time Dependent Haze formation, particle gain, and other defects to identify the "shelf-life" of an unsealed wafer versus one protected by our high-end packaging.
PCN Documentation: Prepare the technical data packages required for Process Change Notifications (PCN), providing the evidence needed to upgrade our shipping standards for Tier-1 automotive and industrial customers.