SEMRON-posted 2 months ago

In this role you'll be responsible to design the next iteration of SEMRON's 3D in-memory compute chip. You will collaborate with a team of hardware, compiler and ML engineers to optimise all aspects of executing ML workloads based on our capacitive analog in-memory matrix-vector multiplication units.

  • Design and specify the structure and internal organisation of core architecture modules, aligned with workload requirements and software deployment processes.
  • Partner with the software team to evaluate module performance and efficiency for key workloads, uncover performance constraints, and inform architectural choices.
  • Monitor emerging trends and research in AI workloads, hardware architectures, and applications to guide the evolution of next-generation architectures.
  • BS/MS/PhD in EE, CS, or a related field
  • Understanding in computer architecture, digital design, and micro-architecture concepts
  • Familiarity with AI/ML algorithms, frameworks, and workloads
  • Programming experience in C/C++ and Python
  • Hands-On Experience with ML Hardware Exploration Frameworks like Timeloop, ZigZag, etc.
  • Hands-On Experience with HDLs such as Verilog or System Verilog
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