Micron Technology-posted 2 months ago
Richardson, TX
5,001-10,000 employees
Computer and Electronic Product Manufacturing

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Heterogeneous Integration Group (HIG) is shaping the future of AI and accelerated computing by developing sophisticated memory solutions! The team focuses on designing and optimizing High Bandwidth Memory (HBM) products for AI/ML, high-performance computing (HPC), and data-centric systems, collaborating across global engineering and product teams to deliver industry-leading performance, power efficiency, and reliability. The HBM product family is growing due to high demand from industry leading semiconductor companies! As an HBM Memory Design Engineer in sustaining role you will be working with teams like Design Engineering (DE), Product Engineering (PE), Process Integration, Packaging and Technology Development (TD) on evaluating silicon issues seen on all the current HBM designs. You will interact with the architecture team to understand new or modified specification requests, and you will work with the team on implementing and verifying the design, supporting the design release to silicon and all future needs arising for the design. You will have an opportunity to rotate to a Design Engineer role and work on the next generation HBM products.

  • Contribute to the design, layout, and optimization of Memory, Logic, and Analog circuits for HBM products.
  • Parasitic modeling and assisting in design validation, reticle experiments, and required tape-out revisions.
  • Collaborate with layout teams to meet floorplanning, placement, and routing requirements.
  • Simulate and verify designs using industry-standard tools (e.g., FINESIM, HSPICE, Verilog).
  • Perform extensive power delivery network analysis and optimization.
  • Assist in running various design checks prior to initial tapeout and revision tapeout.
  • Be proactive in identifying and flagging design issues, performance problems, and opportunities to improve design performance and reduce power consumption.
  • Debug and identify root causes and solutions for pre-silicon and post-silicon issues encountered in current HBM products.
  • Provide mentorship and support to team members.
  • Review and check design specifications to ensure high quality.
  • Engage with various teams like Product Engineering, Test, Probe, Process Integration, Packaging, Technology Development and Marketing to ensure performance & manufacturability, to support issues with current HBM designs and find opportunities to innovate on future HBM solutions.
  • BS or MS in Electrical Engineering or a related equivalent field.
  • Proven relevant experience of 12+ years with BS or 10+ years with MS.
  • Extensive knowledge of CMOS circuit design and good understanding of semiconductor device physics.
  • Experience with schematic entry, digital (Verilog) and analog (FastSpice & Hspice) modeling and simulations.
  • Good understanding of timing/area/power/complexity trade-offs in DRAM or mixed-signal design.
  • Extensive knowledge with DRAM operation and JEDEC specifications, preferably with the HBM product family.
  • In depth technical expertise in one or more areas - memory array design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, 3D packaging technologies.
  • Good verbal and written communication skills with the ability to efficiently synthesize and convey sophisticated technical concepts to other team members and leadership.
  • Experience with scripting languages (Python, TCL, Perl, etc.)
  • Proven track record of innovation and problem-solving in high-performance memory development.
  • Good experience with RTL Design flow, in DRAM process or Foundry process.
  • Prior experience with package technologies (TSV, hybrid bonding, interposers, etc).
  • Choice of medical, dental and vision plans.
  • Benefit programs that help protect your income if you are unable to work due to illness or injury.
  • Paid family leave.
  • Robust paid time-off program.
  • Paid holidays.
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