MTS HBM Design Architect

Micron Technology • Folsom, CA

7d

About The Position

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing.
For more than 43 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming how the world uses information to enrich life.
As an HBM Design engineer in the HBM architect team you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. This includes simulating, optimizing and floor planning DRAM circuits. You will need to have the ability to evaluate Full chip or block level functionality and provide solutions to help delivery of functionally correct design. You will work with a highly innovative and motivated design team using state of the art memory technologies to develop the most advanced HBM products.

Requirements

• Extensive knowledge of CMOS Circuit Design and Device Physics.
• Extensive knowledge of schematic entry and simulation using Finesim and/or Hspice.
• Excellent problem-solving and analytical skills.
• A self-motivated, enthusiastic team player who enjoys working with others.
• Good communication skills with the ability to convey complex technical concepts to other design and verification peers in verbal and written form.
• BSEE or higher with 8+ years of relevant engineering experience

Nice To Haves

• Design or Verification experience of advanced DRAM architecture such as 3D DRAM is a plus.

Responsibilities

• Possess knowledge in one or more areas such as DRAM circuit design, high-speed clocking and interface development, logic and custom circuit design, power delivery optimization, CMOS & semiconductor device physics.
• Evaluate full chip or block level functionality and provide solutions to ensure the delivery of a functionally correct design.
• Have a good understanding of timing/area/power/complexity trade-offs in high-speed DRAM or mixed-signal design.
• Conduct pathfinding to explore new architectures for future HBM products and make recommendations after performing highly technical feasibility analyses.
• Contribute to the development of new HBM product opportunities by assisting with the overall design, layout, and optimization of Memory, Logic, and Analog circuits.

Benefits

• Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time-off program and paid holidays.
• For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 5,001-10,000 employees