We are seeking a highly motivated PhD-level scientist or engineer to develop and apply advanced modeling capabilities for plasma processing applications, including plasma etching, plasma-enhanced deposition, and atomic layer etching (ALE). This role focuses on understanding, modeling, and predicting plasma–surface interaction processes using a combination of physics-based methods and data-driven approaches. The ideal candidate will have hands-on experience with atomistic and mesoscale modeling techniques such as ab initio quantum chemistry, molecular dynamics (MD), and kinetic Monte Carlo (kMC). In addition, the candidate will be expected to develop and deploy machine learning (ML) models trained on data generated from large-scale, multi-dimensional high-performance computing (HPC) simulations, complemented by experimental measurements. This position offers a unique opportunity to work at the intersection of first-principles modeling, large-scale simulation, and modern AI/ML methods, contributing directly to accelerated technology and product development in the fast-paced semiconductor equipment industry.
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Job Type
Full-time
Education Level
Ph.D. or professional degree
Number of Employees
11-50 employees