Microelectronics Wire Bonder

Lockheed Martin•Chelmsford, MA

12d•Onsite

About The Position

You will be the Microelectronics Wire Bonder for the Fabrication Team. Our team is responsible for producing high‑precision hybrid microcircuits and sub-assemblies that enable advanced electronic systems. What You Will Be Doing As the Microelectronics Wire Bonder your responsibilities will include, but are not limited to: Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies. Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques. Screen defective hybrids by visual or mechanical testing, wirebonds or chip placement. Perform final assembly operations such as attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages. Why Join Us We are looking for a meticulous, hands‑on professional who thrives in a fast‑paced, technology‑driven environment. The ideal candidate is detail‑oriented, enjoys solving complex fabrication challenges, and values the impact of delivering reliable microcircuit solutions to critical missions. We are committed to supporting your work‑life balance and overall well-being. Learn more about Lockheed Martin’s comprehensive benefits package here . Further Information About This Opportunity This position is in Chelmsford. Discover more about our Chelmsford, Massachusetts location. MUST BE A U.S. CITIZEN - This position is located at a facility that requires special access. The selected candidate must be able to obtain a Secret clearance. A company‑sponsored interim Secret clearance is required to start.

Requirements

Familiarity with bonding microelectronic components and familiarity with manual gold ball and ribbon bonding.
Basic computer skills required, including ability to navigate digital systems for timekeeping, work instructions, and task confirmation.
Strong attention to detail and ability to work in a fast-paced environment.
Ability to follow written and verbal instructions.
Knowledge of ESD procedures and equipment.
Strong work ethic and a reputation for punctuality and reliability, with a desire to grow and learn in their role.
High school diploma or GED required.
Ability to obtain and maintain a Secret clearance, which requires U.S. citizenship.

Nice To Haves

Familiarity with manual bonding equipment and with automatic bonding equipment.
Ability to learn J-STD-001 and/or IPC-A-610.
Use microscopes, measuring instruments, and electronic test equipment to meet quality requirements.
Use various hand tools (such as tweezers, rulers, and cutters) and pneumatic tools (such as torque drivers, and screwdrivers).

Responsibilities

Performs fabrication or modification tasks on hybrid microcircuits and sub-assemblies.
Performs fabrication of hybrid microcircuits; e.g., aluminum and gold wirebonding under conditions such as small pad sizes down to .001 inch squares, very high semiconductor chip density, unusual substrate configurations which require special setup and bonding techniques.
Screen defective hybrids by visual or mechanical testing, wirebonds or chip placement.
Perform final assembly operations such as attachment of feedthrough pins, soldering of coils, and mounting of substrates in special non-standard packages.