Microelectronics Process Engineer

Paradromics, Inc. • Austin, TX

3d • Onsite

About The Position

About Paradromics
Brain-related illness is one of the last great frontiers in medicine, not because the brain is unknowable, but because it has been inaccessible. Paradromics is building a brain-computer interface (BCI) platform that records brain activity at the highest possible resolution: the individual neuron. AI algorithms then decode this massive amount of brain-data, enabling the seamless translation of thought into treatments.
Our first clinical application, the Connexus® BCI, will help people who are unable to speak, due to ALS, spinal cord injuries and stroke, to communicate independently through digital devices. However, the capabilities of our BCI platform go far beyond our first application. With the brain in direct communication with digital devices, we can leverage technology to transform how we treat conditions ranging from sensory and motor deficits to untreatable mental illness.
The Role
Paradromics is seeking a Microelectronics Process Engineer to join the Process Engineering team in Austin, TX. This role will own and improve in-house backend microfabrication and microelectronics assembly processes that are critical to delivering reliable, high-performance medical devices. The ideal candidate is hands-on, data-driven, and comfortable taking full ownership of manufacturing processes from development through production.

Requirements

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, or a related technical field.
• 3-5+ years of hands-on experience with backend microfabrication and/or SMT processes (e.g., wire bonding, flip chip bonding, epoxy/flux dispensing, solder bumping, reflow).
• Demonstrated experience owning manufacturing processes, writing operations procedures, and driving measurable yield improvements.
• Strong data analysis skills, including data extraction, statistical analysis, and visualization.
• Familiarity with Python for Data Analysis and automated electrical tests.
• Strong cross-functional communication skills and the ability to work effectively with design, reliability, and operations teams.

Nice To Haves

• Experience transferring processes from R&D to production or bringing outsourced processes in-house.
• Prior experience using Oscilliscopes, Source meters, Multi-meter and Signal Generators for testing electrical components.
• Experience applying structured problem-solving methodologies such as DOE, 8D, 5-Why, or Ishikawa analysis.
• Knowledge of industry standards such as IPC, JEDEC, and MIL-STD related to microelectronics assembly and testing.
• Experience in regulated industries, particularly medical devices.

Responsibilities

• Own and maintain in-house backend microfabrication and microelectronics assembly processes, including wire bonding, flip chip bonding, solder bumping, underfill/epoxy dispensing, reflow, and related SMT processes.
• Maintain in-house testing protocols, ensuring accurate functional and parametric characterization of devices and subcomponents.
• Drive yield, quality, and cycle-time improvements through structured process improvement initiatives, including DOE and root cause analysis.
• Lead efforts to bring currently outsourced microelectronics assembly processes in-house where feasible.
• Investigate, document, and disposition non-conformances related to owned processes.
• Collaborate closely with design, quality, and supply chain teams to support product development, scaling, and process transfer.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level