Microelectronics Packaging Intern (Summer 2026)(Onsite)

RTX • Cedar Rapids, IA

3d • Onsite

About The Position

At Collins Aerospace, our Applied Research and Technology (ART) team helps civilian, military and government customers complete their most complex missions — whatever and wherever they may be. Our customers depend on us for intelligent and secure communications, missionized systems for specialized aircraft and spacecraft and collaborative space solutions. By joining our team, you’ll have your own critical part to play in ensuring our customer succeeds today while anticipating their needs for tomorrow. The Microelectronics Packaging group within ART is seeking to fill a Mechanical Engineering internship position. This group is responsible for the Microelectronics Packaging technology activities throughout Collins Aerospace. This mechanical engineer will be involved in all aspects of microelectronics packaging design and must possess strong mechanical engineering skills including the desire to design and develop state-of-the-art miniaturized electronic devices. This role is onsite, in Cedar Rapids, Iowa. This role may be eligible for relocation.

Requirements

• Requires a High School Diploma or equivalent and student must be pursuing a Bachelor’s or advanced degree in an applicable discipline.
• U.S. citizenship is required, as only U.S. citizens are authorized to access information under this program/contract.

Nice To Haves

• Candidates for this role should be pursuing an engineering degree from an accredited University in a Science, Technology, Engineering, or Math (STEM) discipline.
• Working knowledge of mechanical 2D/3D CAD, basic electrical circuits, thermal concepts.
• Experience with or knowledge of microelectronics design and manufacturing assembly and packaging materials and material properties.
• Electronic component reliability testing.
• Post wafer fabrication processes.
• Failure analysis techniques.
• Additive Manufacturing.

Responsibilities

• You will participate in Microelectronics product development activities including packaging concepts, preliminary/detailed board design and package road mapping efforts.
• You will develop technologies required for next generation packages.
• You will coordinate prototype package builds and evaluation efforts.
• You will qualify microelectronic packages.
• You will support factory transition of products.
• You will provide manufacturing support for Microelectronic assemblies currently in production.

Benefits

• Hired applicants may be eligible for benefits, including but not limited to, medical, dental, vision, life insurance, short-term disability, long-term disability, 401(k) match, flexible spending accounts, flexible work schedules, employee assistance program, Employee Scholar Program, parental leave, paid time off, and holidays.
• Specific benefits are dependent upon the specific business unit as well as whether or not the position is covered by a collective-bargaining agreement.
• Hired applicants may be eligible for annual short-term and/or long-term incentive compensation programs depending on the level of the position and whether or not it is covered by a collective-bargaining agreement.
• Payments under these annual programs are not guaranteed and are dependent upon a variety of factors including, but not limited to, individual performance, business unit performance, and/or the company’s performance.

What This Job Offers

• Career Level: Intern
• Education Level: High school or GED