Microelectronics Assembler

Rodelco Electronics•Ronkonkoma, NY

4d•$27 - $32•Onsite

About The Position

Rodelco Electronics, a small fast-growing business located in Ronkonkoma NY that serves the military electronics markets, has an opening for a Microelectronics Assembler . In this position the individual will be responsible for assembly of custom electronic components for high reliability applications. The ideal candidate will have experience in assembly of chip and wire micro-assemblies working under a microscope. The specific job duties will consist of the following: Primary Job Duties: Perform a variety of micro-chip and wire assembly operations under a microscope. Perform manual die bonding, wire bonding, ribbon bonding or other cleanroom operations. Knowledge of automatic wire bonding, automatic die bonding machines or any automatic electronic assembly equipment is a plus++. This position requires steady hands for handling ultra- miniature parts which may only be visible through microscope. The applicant must have good eyesight and manual dexterity. Use small hand tools such as tweezers and pin probes under a microscope is required. The ability to read and interpret assembly drawings, operation instructions and assembly procedures is required. Assist in meeting department production goals and work in a team environment. Most of the work will be perform in a clean room environment. Job Qualifications - Education/Experience: 1 to 3-years working as a Micro assembly/Mechanical assembly preferred or related experience. The Micro-Assembler will work closely with Engineering, Test and Inspection and will receive on the job training as needed. Able to work independently and within a team High school diploma or equivalent US Citizenship required Rodelco's Benefits: PTO Holiday Pay 401K with company match Profit Sharing Health Insurance Additional Voluntary Benefits

Requirements

1 to 3-years working as a Micro assembly/Mechanical assembly preferred or related experience.
The Micro-Assembler will work closely with Engineering, Test and Inspection and will receive on the job training as needed.
Able to work independently and within a team
High school diploma or equivalent
US Citizenship required

Nice To Haves

Knowledge of automatic wire bonding, automatic die bonding machines or any automatic electronic assembly equipment is a plus++.

Responsibilities

Perform a variety of micro-chip and wire assembly operations under a microscope.
Perform manual die bonding, wire bonding, ribbon bonding or other cleanroom operations.
Use small hand tools such as tweezers and pin probes under a microscope is required.
The ability to read and interpret assembly drawings, operation instructions and assembly procedures is required.
Assist in meeting department production goals and work in a team environment.
Most of the work will be perform in a clean room environment.