MEMS Technical Program Manager, Technical Leader

Cisco Systems, Inc.•Carlsbad, CA

27d

About The Position

Work as part of a world class photonics team on MEMS packaging of optical components and their integration into Cisco's volume transceiver products. Cisco has developed a unique high-volume laser micro-package platform (LaMP) with MEMS-wafers fabricated at a Cisco supplier, specialized assembly and test conducted at in-house designed/developed assembly/test tools and processes that provide a unique opportunity for improvements spanning from design to volume production. This multi-disciplinary position requires an in-depth understanding of MEMS fabrication techniques (bulk micro-machining) as well as more specialized methods for assembly and test of packaged optical components. The ideal candidate will have MEMS production-experience for photonic or sensor applications, familiarity with general semiconductor wafer processing processes and tools, and is proficient with advanced data analysis techniques. Candidates are expected to work closely with Cisco's suppliers as well as Cisco's packaging and test teams to maintain and improve yields, performance, and reliability of critical photonics components by applying structured problem-solving techniques and leverage advanced data collection methods. Qualified candidates are expected to be able to apply advanced problem-solving skills to uncover, root cause and drive corrective action across engineering and manufacturing organizations. You will be working with the core engineering team responsible for development of the Cisco's high volume silicon photonics platform for client optics. You will be part of a dynamic technology development team that works to design devices, processes and tools as part of Cisco' high-volume silicon photonics manufacturing platform. You are an engineer or scientist with experience in one or more of the following areas: MEMS fabrication, semiconductor manufacturing, optical packaging and fiber optic components, electronic assembly and packaging.

Requirements

Bachelors + 12 years of related experience, or Masters + 8 years of related experience, or PhD + 5 years of related experience
experience in one or more of the following areas: MEMS fabrication, semiconductor manufacturing, optical packaging and fiber optic components, electronic assembly and packaging

Nice To Haves

MEMS production-experience for photonic or sensor applications
familiarity with general semiconductor wafer processing processes and tools
proficient with advanced data analysis techniques

Responsibilities

In-depth monitoring of MEMS supplier production performance and quality
Support suppliers in setting up adequate production monitoring, quality control, problem solving, and continuous improvement practices
Conduct failure analysis and physical characterization to root cause process and device failure modes
Lead teams in resolving yield and defectivity issues in the MEMS and LaMP assembly lines
Collaboration with Cisco experts on yield and performance improvement programs and structure supplier improvement projects to achieve these goals
Problem solving of critical technical issues during LaMP production, NPI, and early production yield ramp phases
Drive continuous improvement planning and implementation including validation
Manage technical aspects of the change control process with the suppliers and internal stakeholders
Ensure learnings are documented in relevant engineering documentation and institutional knowledge is expanded across the Cisco teams

Benefits

U.S. employees are offered benefits, subject to Cisco's plan eligibility rules, which include medical, dental and vision insurance, a 401(k) plan with a Cisco matching contribution, paid parental leave, short and long-term disability coverage, and basic life insurance.
Employees may be eligible to receive grants of Cisco restricted stock units, which vest following continued employment with Cisco for defined periods of time.
U.S. employees are eligible for paid time away as described below, subject to Cisco's policies: 10 paid holidays per full calendar year, plus 1 floating holiday for non-exempt employees
1 paid day off for employee's birthday, paid year-end holiday shutdown, and 4 paid days off for personal wellness determined by Cisco
Non-exempt employees receive 16 days of paid vacation time per full calendar year, accrued at rate of 4.92 hours per pay period for full-time employees
Exempt employees participate in Cisco's flexible vacation time off program, which has no defined limit on how much vacation time eligible employees may use (subject to availability and some business limitations)
80 hours of sick time off provided on hire date and each January 1st thereafter, and up to 80 hours of unused sick time carried forward from one calendar year to the next
Additional paid time away may be requested to deal with critical or emergency issues for family members
Optional 10 paid days per full calendar year to volunteer

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