At AMD, our mission is to build great products that accelerate next-generation computing experiences—from AI and data centers, to PCs, gaming and embedded systems. Grounded in a culture of innovation and collaboration, we believe real progress comes from bold ideas, human ingenuity and a shared passion to create something extraordinary. When you join AMD, you’ll discover the real differentiator is our culture. We push the limits of innovation to solve the world’s most important challenges—striving for execution excellence, while being direct, humble, collaborative, and inclusive of diverse perspectives. Join us as we shape the future of AI and beyond. Together, we advance your career. THE ROLE: As a member of the IO and Circuit Technologies Group, you will contribute to the development and productization of advanced high‑speed memory interface IP. In this position, you will join the High‑Speed IO Interface IP engineering team and work closely with architecture, IP design, physical design, SoC, platform, product, and other cross‑functional engineering teams. You will help deliver industry‑leading HBM, DDR, and LPDDR memory interface solutions from design through silicon implementation. THE PERSON: The ideal candidate brings strong technical capabilities, attention to detail, and clear communication skills. They collaborate effectively with silicon design engineers and multidisciplinary teams and demonstrate solid analytical and problem‑solving abilities when working on both pre‑silicon and post‑silicon challenges.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees