Mechanical Engineering Internship - Summer 2026

Qualcomm • Santa Clara, CA

73d • $17 - $98 • Remote

About The Position

Qualcomm relentlessly innovates transforming businesses, enriching lives and fortifying societies. Our solutions are pivotal in crafting a smarter, interconnected world. Building on our nearly 40-year history of era-defining technology breakthroughs, we deliver leading-edge AI, high performance, lower-power computing, and unrivaled connectivity. We're proud to be the partner of choice to many of the world's largest enterprises. Together with our ecosystem partners, we enable next-generation digital transformation. At Qualcomm, we are engineering human progress. As a Qualcomm Mechanical Engineering Intern, you'll have the opportunity to push the boundaries of what exists and help establish the new standards for tomorrow. You will work as an equal contributor on a team of leading engineers to design, simulate, and test mechanical and thermal systems that support Qualcomm's advanced semiconductor technologies. Projects may span IC packaging, chip/package co-design, thermal modeling, signal and power integrity, and next-generation cooling solutions.

Requirements

• Currently enrolled in a bachelor's, master's, or Ph.D. degree program in mechanical engineering, materials science, or a related field.
• Must be available for 11-14 weeks during Summer 2026 (May-September).
• Expected graduation date of November 2026 or later.
• 1+ years of academic experience with programming languages such as Python, Matlab.

Nice To Haves

• Familiarity with Cadence Sip, AutoCAD, and Solidworks.
• Coursework in Solid Mechanics, Mechanics of Materials, and Finite Element Analysis (FEA).
• Knowledge of IC packaging structures, chip-package interaction, and electronic packaging processes.
• Experience with thermal system design, modeling, and testing.
• Understanding of heat transfer, mechanical design, and microelectronics.
• Exposure to server product design, system impedance testing, fan performance measurement, and heatsink design methodology.
• Experience with Computational Fluid Dynamics (CFD), wind tunnel, and/or airflow bench operation.

Responsibilities

• Design, simulate, and test mechanical and thermal systems.
• Contribute to projects related to IC packaging, chip/package co-design, and thermal modeling.
• Work collaboratively with a team of engineers.

Benefits

• Competitive hourly pay.
• Accrued vacation time.
• Relocation coverage.
• Furnished housing accommodations for the duration of the internship.

What This Job Offers

• Career Level: Intern
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Bachelor's degree
• Number of Employees: 5,001-10,000 employees