Mechanical Engineer - Advanced Engineering

SST Direct•San Francisco, CA

19h•$200,000 - $300,000

About The Position

Direct Hire opportunity for a Mechanical Engineer to join an Advanced Engineering team, responsible for designing and optimizing HVDC and LVDC power systems for advanced data center environments. This role focuses on developing high-performance thermal and magnetic solutions that support reliable, large-scale GPU deployments. Salary: $200,000-$300,000 per year, depending on experience, skills, qualifications Relocation assistance provided for the right candidate

Requirements

7+ years of mechanical design experience in power systems, high-power electronics, or energy infrastructure with strong thermal management background.
Deep expertise in structural design, heat transfer, CFD analysis, electronics packaging, and outdoor-rated electrical equipment enclosures.
Proficient in CAD software (SolidWorks, AutoCAD) and thermal simulation tools (Ansys Fluent or similar), familiar with high-voltage DC systems and NEC, UL, or IEC standards.
Self-starter who thrives in fast-paced environments and can drive complex thermal-mechanical-electrical integration projects independently with minimal oversight.
Strong understanding of materials for high-power applications including copper/aluminum alloys, thermal interface materials, potting compounds, and high-voltage insulation systems.
Experience with Design for Manufacturing/Assembly principles, manufacturing processes (sheet metal, machining, casting), and bringing designs from prototype through to high-volume production

Responsibilities

Lead mechanical and thermal design of HVDC/LVDC power distribution systems and high-power electronics for multi-gigawatt GPU data center deployments.
Design enclosures, structural assemblies, and integrated cooling solutions for high-voltage DC power equipment and power electronics.
Perform thermal analysis (CFD) and develop heat dissipation strategies for high-power density systems, including cold plates, heat exchangers, busbars, and airflow management.
Solve high-current busbar design challenges including conductor sizing, thermal interface optimization, and electrical contact resistance management for multi-megawatt systems.
Address EMI/EMC shielding, creepage/clearance requirements, and mechanical integration of power modules, capacitors, and semiconductor devices in compact, high-reliability packages.
Define and execute mechanical and thermal validation testing including structural FEA, thermal cycling, vibration, and environmental qualification for power electronics assemblies.