Mechanical Engineer - Thermal Analysis (Level II)

Lockheed Martin•Sunnyvale, CA

22h•Onsite

About The Position

Space is a critical domain, connecting our technologies, our security and our humanity. While others view space as a destination, we see it as a realm of possibilities, where we can do more — we can innovate, invest, inspire and integrate our capabilities to transform the future. At Lockheed Martin Space, we aim to harness the full potential of space to cultivate innovation, reduce costs, and push the boundaries of what technology can achieve. We’re creating future-ready solutions, focusing on resiliency and urgency through our 21st Century Security® vision. We’re erasing boundaries and forming partnerships across industries and around the world. We’re advancing spacecraft and the workforce to fuel the next generation. And we’re reimagining how space can connect us, ensuring security and prosperity. Join us in shaping a new era in space and find a career that's built for you. For over 60 years, the Fleet Ballistic Missile (FBM) team has supported the Navy’s mission to provide affordable and credible strategic defense. We offer unique career opportunities and challenges on a program with a rich history and exciting future. We help keep this nation and our allies secure. We are a community of engineers looking for an enthusiastic Mechanical Engineer to join the tight-knit group. The FBM Trident II D5 Life Extension 2 program (D5LE2) is ramping up to become one of Lockheed Martin’s premier Lines of Businesses that prioritizes partnership, integrity, and reliability. Learn about the Trident II D5 Fleet Ballistic Missile. If so, join us as a part of a highly-skilled analysis team for missiles and spacecraft systems! Lockheed Martin Space is seeking a Mechanical Engineer to join our Missile Flight Sciences team in Sunnyvale, CA! This position will have the exciting opportunity support the Aerothermal team, and the successful candidate will be responsible for the following:

Requirements

Knowledge of one or more of the following topics: thermodynamics, heat transfer, aero heating, material properties, computer programming
Knowledge of electronics/avionics heating & cooling
Understanding of physics-based modeling, simulation, and/or analysis
Ability to obtain a Top Secret clearance; US citizenship is required

Nice To Haves

Bachelor’s degree (5+ years of experience) or Master’s degree (3+ years of experience) in Physics, Aerospace Engineering, Mechanical Engineering, or a related discipline
Demonstrated experience in the following topics: thermodynamic analysis, heat transfer analysis, aeroheating analysis, material properties & characterization, and computer programming (Matlab, Python, Fortran)
Experience analyzing thermal systems and subsystem-level components, particularly electronic/avionic packages under operating environments and providing cooling/insulation recommendations
Strong mathematical, analytic, and data processing skills
Experience with any of the following software packages: NX Thermal (Preferred), Thermal Desktop, SINDA, TSS, Abaqus
Knowledge or experience with testing & instrumentation including test procedure development, instrumentation definition, test direction, and post-test model correlation
Excellent communication skills, both written and verbal, including MS Office proficiency
Experience with modern collaboration tools, such as Jira and Confluence
Active Top Secret clearance

Responsibilities

Performing thermal analyses on missile subsystem-level hardware & avionics packages for the FBM D5LE2 program
Ownership of computational, physics-based modeling, simulations, and results
Correlate model results to subsystem & package requirements and support risk mitigation
Work and interact with multiple engineering fields across multiple sites
Present key findings and results to internal and external customers & stakeholder
Provide recommendations to support peer and customer reviews
Leverage thermal analysis expertise to support key program milestone reviews
Provide documentation and recommendations to data packages to support key discussions, present analysis data to engineering teams, customer technical representatives, and Program Office personnel at technical interchange meetings and program milestone design reviews