Mechanical Design Engineer

Intel Corporation

6d • Onsite

About The Position

Amazing experiences start with amazing opportunities in the dynamic field of silicon photonics. We are looking for an exceptional candidate to work in a fast-paced environment developing start of the art mechanical and opto-mechanical design for next generation of co-packaged optics and optical interconnect products (CPO/OCI). You will contribute to Intel Integrated Photonics Group's (IPS) mission to transform and lead Data Center optical connectivity and enable Intel's differentiation in the networking space. Your responsibilities will include: Developing opto-mechanical packaging design for state-of-the-art co-packaged Silicon Photonics (SiPh) devices and assemblies in data center. Package designs and technology selection Assess and mitigate risks associated with the product designs Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements Identify new suppliers for design, develop and manage existing suppliers Define and conduct overall tolerance analysis for component and sub-assemblies Design assembly, test tooling and fixturing required for design validation Interacting with suppliers and optimizing designs based on supplier's processes and capabilities Creating component drawings, layouts, assembly drawings for product and tooling Generating Bill of Materials (BOM)

Requirements

• BS with 4+ years of experience in product design and development from initial conceptual design to high volume production
• 3+ years of experience in high volume manufacturing fabrication processes including machining, sheet metal stamping, metal/plastic injection molding and die casting
• 3+ years of experience in 3D design software such as Solidworks and enterprise data management system such as ePDM, windchill
• 3+ years of experience working with product documentation, schematics, and Bill of Materials

Nice To Haves

• MS or advanced degree is preferred in related engineering field.
• 3+ years of experience in product mechanical design preferably in the fiber optics or semiconductor packaging environment.
• 3+ years of design and assembly experience in high volume product environment such as optical transceivers, cell phones, disk drives or automation.
• 1+ years of experience in the optical/photonics industry.
• 2+ years of experience in product thermal design and knowledgeable on cooling devices and thermal interface materials.
• 1+ years of experience with design simulation for stress and thermal.
• 1+ years of experience in CFD (Computational Fluid Dynamics) modeling tools such as ICEPAK, FLOTHERM, etc.
• 2+ years of experience in FEA (Finite Element Analysis) structural/stress analysis and tools such as Abaqus or ANSYS.
• 2+ years of proven experience in executing complex projects that require cross-functional teamwork is preferred.

Responsibilities

• Developing opto-mechanical packaging design for state-of-the-art co-packaged Silicon Photonics (SiPh) devices and assemblies in data center.
• Package designs and technology selection
• Assess and mitigate risks associated with the product designs
• Working with cross-functional groups to determine package requirements in order to meet electrical, optical, mechanical, thermal, and reliability requirements
• Identify new suppliers for design, develop and manage existing suppliers
• Define and conduct overall tolerance analysis for component and sub-assemblies
• Design assembly, test tooling and fixturing required for design validation
• Interacting with suppliers and optimizing designs based on supplier's processes and capabilities
• Creating component drawings, layouts, assembly drawings for product and tooling
• Generating Bill of Materials (BOM)

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level