We are seeking a highly skilled and motivated Advanced Packaging and Technology Manufacturing Engineer to join our dynamic team. This role will focus on supporting advanced packaging technologies including Embedded Interconnect Bridge (EmIB), Foveros, High Bandwidth Interconnect (HBI), substrates, and assembly processes. The successful candidate will play a critical role in driving process development efforts through first principles modeling, frequent calibration to empirical and experimental data, and collaborative problem-solving across multiple partner organizations.