Mechanical and Process Development Packaging Engineer

Intel • Hillsboro, OR

147d • $177,200 - $250,160 • Hybrid

About The Position

We are seeking a highly skilled and motivated Advanced Packaging and Technology Manufacturing Engineer to join our dynamic team. This role will focus on supporting advanced packaging technologies including Embedded Interconnect Bridge (EmIB), Foveros, High Bandwidth Interconnect (HBI), substrates, and assembly processes. The successful candidate will play a critical role in driving process development efforts through first principles modeling, frequent calibration to empirical and experimental data, and collaborative problem-solving across multiple partner organizations.

Requirements

• Master's degree in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related technical field with 10+ years of relevant experience.
• PhD in Materials Science, Electrical Engineering, Chemical Engineering, Mechanical Engineering, or a related technical field with 7+ years of relevant experience.
• Relevant Experience in advanced packaging technologies such as EmIB, Foveros, HBI, substrates, and assembly.
• Wafer fabrication techniques (electrodeposition, bumping, thin films, planarization, singulation).
• Expertise in process simulation and modeling with frequent calibration against experimental data.

Nice To Haves

• Experience with semiconductor manufacturing environments and terminology.
• Hands-on Experience with experimental design and data acquisition methods.
• Experience with relevant simulation tools and data analysis software is a plus.
• Previous related work experience in a semiconductor foundry preferred.

Responsibilities

• Develop and apply first principles models to support and optimize advanced packaging manufacturing processes.
• Perform regular calibration and validation of models with empirical and experimental data to ensure accuracy and applicability.
• Partner with cross-functional teams and external organizations to translate abstract challenges into well-defined problem statements and actionable solutions.
• Utilize deep understanding of wafer fabrication processes including electrodeposition, bumping, thin films, planarization, and singulation.
• Simulate manufacturing processes and leverage results to troubleshoot and solve real-world production issues.
• Communicate technical progress, challenges, and recommendations effectively with both technical and non-technical stakeholders.
• Support continuous improvement initiatives and implementation of new technologies in packaging manufacturing.

Benefits

• Competitive pay
• Stock options
• Bonuses
• Health benefits
• Retirement plans
• Vacation

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Industry: Computer and Electronic Product Manufacturing
• Education Level: Master's degree