Manager - Mechanical and Thermal Engineering

Intel CorporationHillsboro, OR
Hybrid

About The Position

Join Intel's Networking Platforms Operation as an Engineering Manager leading cutting-edge hardware design for FNIC and IPU board products. This player-coach role combines strategic leadership with hands-on technical expertise, managing a dynamic team of mechanical, thermal, and board layout engineers developing next-generation networking technology. The role involves defining technology roadmaps for board design, translating customer requirements into executable design solutions, and coaching team members in advanced technology development and career growth. The manager will drive the development and implementation of innovative board product solutions, partner with various engineering and product teams to deliver industry-leading power, performance, and design, and establish strategic partnerships to foster innovation. Operational leadership responsibilities include managing resources and priorities to meet project timelines, fostering cross-team collaboration, setting clear performance goals, and promoting an inclusive, high-performance work environment.

Requirements

  • Bachelor's degree in Mechanical/Manufacturing Engineering or in a related field and 7+ years of experience
  • 5+ years of leadership experience managing engineering teams
  • 5+ years of experience with server platforms and data center technologies
  • Experience with cloud enterprise and telecommunications infrastructure applications
  • Experience in heat transfer, CFD analysis, and materials selection for electronics cooling
  • Experience with high-density PCB layout constraints and complex PCBA assembly integration

Nice To Haves

  • Post Graduate Degree in in Mechanical/Manufacturing Engineering or in a related field
  • Proficiency in CAD software (SolidWorks preferred)
  • Experience with thermal simulation tools (Ansys, FloTHERM, or equivalent)
  • Background working with OEMs, ODMs, or contract manufacturing partners
  • Experience in assembly and manufacturing processes

Responsibilities

  • Lead and develop a cross-functional team of mechanical, thermal, and CAD engineers
  • Define technology roadmaps for board design aligned with Intel's strategic objectives
  • Translate customer requirements and product architecture into executable design solutions
  • Coach and mentor team members in advanced technology development and career growth
  • Drive development and implementation of innovative board product solutions
  • Partner with engineering, product planning, and customer-facing teams to deliver industry-leading power, performance, and design solutions
  • Establish strategic partnerships with industry leaders to foster innovation and research collaboration
  • Develop long-term capability strategies for emerging technological requirements
  • Manage resources and priorities to meet aggressive project timelines
  • Foster cross-team collaboration to maximize operational outcomes
  • Set clear performance goals and maintain accountability for team results
  • Promote an inclusive, high-performance work environment

Benefits

  • competitive pay
  • stock bonuses
  • health benefit programs
  • retirement benefit programs
  • vacation benefit programs
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